Laser Diode Substrate with Through-Hole Thermal Pathways
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Laser diodes for automotive lamp modules face challenges due to complex structures and inefficient heat dissipation, as existing substrates have insulation regions that hinder effective heat transfer.
Innovation Solution
A laser diode mounting substrate with a copper-plated first and second heat conduction layer, featuring heat transfer holes and fastening holes, allows for efficient heat dissipation by connecting upper and lower heat sinks, while also providing a simple structure and compact size for automotive applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing substrates with insulation regions are used, then electrical insulation is provided, but heat dissipation efficiency deteriorates
Solution Approach 1:
The substrate is segmented into multiple functional regions: insulation regions for electrical isolation and heat conduction regions with copper plates for heat dissipation. Heat transfer holes are also segmented throughout the substrate to create thermal pathways. This segmentation allows simultaneous achievement of electrical insulation and effective heat dissipation by assigning different thermal properties to different regions.
Solution Approach 2:
Different regions of the substrate are given different thermal qualities: insulation regions maintain low thermal conductivity for electrical isolation, while heat conduction regions incorporate copper plates with high thermal conductivity for heat dissipation. The heat transfer holes are strategically positioned to create localized thermal pathways from the laser diode mounting area to the heat sinks, ensuring heat is efficiently removed from critical areas.
2Adaptability or versatility
If laser diodes are used in automotive lamp modules, then advanced lighting functionality is achieved, but structural complexity increases
Solution Approach 1:
Multiple functions are merged into a single substrate structure: the substrate provides mechanical support for the laser diode, electrical insulation through dedicated insulation regions, heat conduction through copper-plated regions, and thermal management via heat transfer holes connecting to heat sinks. The connector is integrated directly into the substrate, eliminating the need for separate mounting components and reducing overall structural complexity.
Solution Approach 2:
The substrate serves multiple purposes simultaneously: it acts as a mechanical base for mounting the laser diode, provides electrical insulation to prevent short circuits, functions as a heat conduction pathway through copper plates, and serves as a thermal management interface through heat transfer holes that connect to heat sinks. This multi-functionality reduces the need for separate components and simplifies the overall device structure.
3Temperature
If heat sinks are added for heat dissipation, then thermal management is improved, but device size increases
Solution Approach 1:
The heat conduction structure is nested within the substrate itself. Copper plates are integrated into the substrate layers, and heat transfer holes are formed through the substrate body, creating a nested thermal management system. The upper and lower heat sinks are positioned on opposite sides of the substrate, with thermal pathways nested within the substrate thickness, minimizing the overall volume occupied by the thermal management system.
Solution Approach 2:
Heat dissipation is achieved by utilizing the vertical dimension through heat transfer holes that extend through the substrate thickness. Instead of expanding the heat sink footprint in the horizontal plane, the thermal pathways are created in the vertical dimension, allowing efficient heat removal without significantly increasing the device's planar dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate effectively dissipates heat generated by the laser diode, enabling reliable operation in automotive environments by enhancing heat transfer between heat sinks and fixing the diode while supplying power.
Implementation Method 1
a first heat conduction layer disposed at the area except for the power supply circuit pattern, on the top of the substrate body; and a second heat conduction layer disposed on the bottom of the substrate body
Implementation Method 2
at least one heat transfer hole is disposed through the first heat conduction layer, the substrate body, and the second heat conduction layer
Data Source
AI summary
Provided is a laser diode mounting substrate for an automotive lamp module using a laser diode. The substrate includes: a substrate body with a power supply circuit pattern, which electrically connects a connector with a contact point of the laser diode, on the top; a first heat conduction layer disposed at the area except for the power supply circuit pattern, on the top of the substrate body; and a second heat conduction layer disposed on the bottom of the substrate body, in which at least one heat transfer hole is disposed through the first heat conduction layer, the substrate body, and the second heat conduction layer. Therefore, the present invention provides an effect that heat generated by the laser diode can be effectively dissipated.