Laser Diode Packaging via Wireless Bonding
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Solution Overview
Problem
Conventional laser diode packaging with wire-bonding structures occupies excessive space, leads to compatibility issues with multiple wires, and results in potential disconnections, compromising reliability and performance, especially in high-power applications.
Innovation Solution
A wireless-bonding process is employed to electrically connect electrodes between substrates using silver paste or solder, eliminating disconnection doubts and reducing packaging space, thereby enhancing component reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire-bonding process is used to electrically connect electrodes, then electrical connection is achieved, but packaging space is excessively occupied and reliability is compromised due to wire disconnection issues
Solution Approach 1:
The patent extracts and eliminates the wire-bonding component from the packaging structure, replacing it with a direct electrode connection method using conductive paste. This removes the problematic wire element that caused both space occupation and reliability issues, achieving the dual benefit of reduced packaging space and improved connection reliability.
Solution Approach 2:
The patent replaces the mechanical wire-bonding system with a chemical/electrical conduction system using conductive paste. Instead of mechanically attaching wires to electrodes, the invention uses a paste-based electrical connection method that eliminates mechanical connection failures while reducing space requirements.
2Power
If multiple wires are used for high-power laser diode packaging, then current load capacity is increased, but verification of electrical compatibility becomes impossible and quality cannot be guaranteed
Solution Approach 1:
The patent merges multiple wire connections into a single integrated conductive paste connection. Instead of using numerous separate wires that are difficult to verify, the conductive paste creates a unified electrical connection that maintains high current capacity while enabling complete verification of electrical compatibility through direct inspection and testing of the paste connection.
Solution Approach 2:
The patent changes the connection medium from discrete wires to conductive paste, altering the physical state from solid wire to paste material. This parameter change enables better verification of electrical properties while maintaining or enhancing current load capacity, as the paste can be thoroughly inspected and tested for electrical compatibility.
3Reliability
If wire-bonding structure is used, then electrical connection is established, but the structure occupies 100 micrometers per electrode width making laser diode reduction in space impossible
Solution Approach 1:
The patent extracts the wire-bonding structure that occupies excessive space and replaces it with a compact electrode connection method using conductive paste. This eliminates the 100 micrometer wire bonding requirement while maintaining reliable electrical connection, enabling significant reduction in electrode width and overall device size.
Solution Approach 2:
The conductive paste acts as a thin film connection medium that provides electrical connection without the bulk required by wire bonding. This thin film approach enables compact electrode design with reduced width while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The wireless-bonding process effectively improves the reliability of laser diode connections by eliminating disconnection issues and minimizing packaging space, ensuring stable performance even under high current loads.
Implementation Method 1
the first electrode and the second electrode are electrically connected to the third electrode and the fourth electrode by silver paste, respectively
Implementation Method 2
the first electrode and the second electrode are electrically connected to the third electrode and the fourth electrode by solder, respectively
Data Source
AI summary
A packaging structure of a laser diode is provided. The packaging structure of the laser diode includes a laser chip, a first substrate and a second substrate. The first substrate having a first electrode and a second electrode on a first surface of the first substrate, and the laser chip is disposed on the first surface of the first substrate; and a second substrate having a third electrode and a fourth electrode on a second surface of the second substrate, wherein the first electrode and the second electrode are electrically connected to the third electrode and the fourth electrode by a wireless-bonding process, respectively.