Laser-Sealed Display Encapsulation for Narrow-Bezel Bonding
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Solution Overview
Problem
Existing display devices face challenges in reducing dead space and improving process accuracy, particularly in organic light emitting display devices, where moisture and dust ingress can occur through the encapsulation process.
Innovation Solution
The solution involves using a first encapsulation part with a thickness of 5-15 um, formed by ultrashort pulse lasers, to create discontinuous interfaces between the display and encapsulation substrates, and a second encapsulation part with a glass powder adhesion member, reducing dead space and enhancing bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a conventional encapsulation process is used, then the display substrate and encapsulation substrate can be sealed, but dead space remains large and process accuracy is insufficient
Solution Approach 1:
The encapsulation structure is divided into multiple parts: a first encapsulation part formed by melting glass powder at bonding areas, and a second encapsulation part filling the remaining sealing area. This segmentation allows precise control over material placement and bonding, reducing dead space while improving manufacturing precision.
Solution Approach 2:
Glass powder is pre-formed into a first encapsulation part at specific bonding areas before the final encapsulation process. This preliminary action ensures that the encapsulation material is positioned accurately, reducing dead space and improving process accuracy during the sealing operation.
2Volume of moving object
If the encapsulation thickness is reduced to minimize dead space, then the dead space is minimized, but bonding strength may be compromised
Solution Approach 1:
The encapsulation structure has different thicknesses and material compositions at different locations: the first encapsulation part at bonding areas provides strong adhesion with discontinuous interfaces, while the second encapsulation part fills the remaining space. This local quality variation ensures bonding strength is maintained where needed while minimizing overall dead space.
Solution Approach 2:
The encapsulation structure uses composite materials: glass powder forms the first encapsulation part with melting properties for strong bonding, while the second encapsulation part uses a different material to fill the sealing area. This composite approach optimizes both bonding strength and dead space reduction.
3Ease of manufacture
If the encapsulation structure is simplified, then the manufacturing process is easier, but moisture and dust ingress prevention is compromised
Solution Approach 1:
The encapsulation process utilizes parameter changes: glass powder is transformed from solid particles to a melted state through laser heating, then solidifies to form a strong bonding interface. This phase change enables effective sealing against moisture and dust while maintaining a relatively simple manufacturing process.
Solution Approach 2:
The conventional mechanical bonding process is replaced with laser-induced melting of glass powder. This substitution eliminates complex mechanical pressing and alignment systems, simplifying the manufacturing process while achieving superior sealing performance against moisture and dust.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively minimizes dead space and improves process accuracy by ensuring strong bonding and sealing, thereby preventing moisture and dust ingress, while maintaining structural integrity.
Implementation Method 1
forming of the nanowire comprises irradiating a first laser, which is a ultrashort pulse laser, onto the encapsulation substrate overlapping the sealing area
Implementation Method 2
combining of the encapsulation substrate and the display substrate with each other comprises irradiating a second laser, which is a ultrashort pulse laser, onto the display substrate overlapping the sealing area
Data Source
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AI summary
A method for manufacturing a display device according to an embodiment of the present invention includes providing a display substrate and an encapsulation substrate, each of which has a display area and a non-display area surrounding the display area thereon, forming a nanowire on the encapsulation substrate overlapping a sealing area defined as a partial area of the non-display area, and combining the encapsulation substrate and the display substrate with each other, wherein the forming of the nanowire includes irradiating a first laser, which is a ultrashort pulse laser, onto the encapsulation substrate overlapping the sealing area, and the combining of the encapsulation substrate and the display substrate with each other includes irradiating a second laser, which is a ultrashort pulse laser, onto the display substrate overlapping the sealing area.