Laser Processing Apparatus with Beam Diverter for Dual Substrate Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current laser processing machines face inefficiencies in productivity due to high overhead times for substrate measurement, alignment, and loading/unloading, leading to idle time for the laser head, and challenges in maintaining consistent scribing depths and energy levels when cutting multiple substrates simultaneously.
Innovation Solution
A laser processing apparatus with a movable diverter and dual work holders allows for continuous operation by diverting the laser beam between two substrates, enabling simultaneous cutting and inspection, reducing overhead time, and maintaining consistent energy levels by directing a single laser beam to each substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single laser head is used for cutting substrates, then the cost of the machine is reduced, but the productivity is lowered due to idle time during overhead operations
Solution Approach 1:
The patent implements a dynamic beam switching system where a single laser head alternates between processing multiple substrates. The laser beam is rapidly directed to different substrates during overhead time, transforming the static single-substrate processing into dynamic multi-substrate processing, thereby improving productivity without increasing laser head count
Solution Approach 2:
The patent eliminates idle time by ensuring the laser head continuously performs useful cutting operations across multiple substrates. During overhead time for substrate changeover, the laser beam is redirected to cut other substrates, maintaining continuous productive action and maximizing laser head utilization
2Productivity
If two laser beams are used to cut substrates simultaneously, then the productivity is increased, but the control of scribing depth consistency becomes difficult
Solution Approach 1:
The patent segments the processing time rather than processing space simultaneously. A single laser beam is divided into sequential processing segments across multiple substrates, with each substrate receiving the full laser energy in turn. This temporal segmentation maintains beam consistency while achieving multi-substrate processing
Solution Approach 2:
The patent introduces a beam switching mechanism as an intermediary between the single laser head and multiple substrates. This mediator rapidly directs the laser beam to different substrates, enabling indirect simultaneous processing while maintaining direct control from a single laser source, ensuring consistent scribing depth across all substrates
3Measurement precision
If the number of vision and focusing points is increased for height measurement, then the measurement precision is improved, but the overhead time is increased
Solution Approach 1:
The patent performs vision alignment and height measurement on substrates in advance during overhead time, before the laser processing begins. By completing all measurement and alignment operations beforehand, the system ensures measurement precision without extending the actual productive processing time
Solution Approach 2:
The patent implements periodic measurement cycles where vision and focusing operations are performed at regular intervals during substrate processing. This periodic approach distributes measurement time efficiently, maintaining precision requirements while minimizing continuous overhead time through structured, rhythmic measurement cycles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases productivity by minimizing idle time of the laser head, improving cutting accuracy and energy control, and reducing the need for dual laser beams, thus enhancing overall throughput and reducing the footprint of the machine.
Implementation Method 1
a laser head for generating a laser beam
Implementation Method 2
laser beam for scribing or singulating a substrate
Implementation Method 3
a diverter positioned along a path of the laser beam, the diverter and the laser head being movable relative to each other between a first position wherein the diverter is operative to divert the laser beam
Data Source
AI summary
A laser processing apparatus for cutting substrates comprises a laser head for generating a laser beam and first and second work holders on which substrates are mountable. A diverter positioned along a path of the laser beam is operative to selectively direct the laser beam towards a first substrate mounted on the first work holder to cut the first substrate, or towards a second substrate mounted on the second work holder to cut the second substrate, so that contemporaneous operations may be conducted on one substrate while the other substrate is being cut.