Laser Drilled Via Interconnects for Display Frame Width Reduction
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Solution Overview
Problem
Current methods for reducing the frame width in display devices are limited by the need for multiple wiring boards and increased production costs, as they require complex wiring configurations to connect conductive layers across substrates.
Innovation Solution
A method involving a first substrate with a conductive layer and a second substrate with a conductive layer, where a protection layer is applied to the second substrate, and a hole is formed using a laser beam to connect the layers electrically, eliminating the need for additional wiring boards by using a connecting material that fills the hole and ensures reliable contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple wiring boards are used to connect conductive layers across substrates, then electrical connection is achieved, but device complexity and production cost increase
Solution Approach 1:
The patent extracts and eliminates the wiring boards from the system by directly forming conductive holes through the substrate to establish electrical connection between conductive layers, thereby simplifying the overall device structure while maintaining connection reliability
Solution Approach 2:
The patent merges the functions of substrate, insulation layer, and wiring board into a single integrated structure where the substrate itself contains the conductive pathways, eliminating the need for separate wiring boards and reducing device complexity
2Reliability
If multiple wiring boards are used to connect conductive layers, then electrical connection is established, but frame width increases
Solution Approach 1:
The patent removes the wiring boards that occupy lateral space and contribute to frame width, replacing them with vertical conductive holes that penetrate the substrate, thereby reducing the overall frame width while maintaining electrical connection functionality
3Manufacturing precision
If protection layer is removed after laser drilling, then hole formation is achieved, but production time increases
Solution Approach 1:
The patent applies the protection layer before laser drilling to prevent damage to the substrate surface during the drilling process, and then removes it afterward, ensuring precise hole formation while managing the additional time required for this protective measure
Solution Approach 2:
The protection layer serves as a cushioning layer that protects the substrate from laser-induced damage during hole formation, allowing for more precise and controlled drilling while preventing harmful effects, with the understanding that the layer will be removed subsequently
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the frame width and production costs by eliminating the need for extra wiring boards and simplifying the connection process between conductive layers, enhancing the reliability of the electrical connection.
Implementation Method 1
forming a first hole penetrating the second substrate by irradiating the second substrate with a laser beam
Data Source
AI summary
According to one embodiment, a method of manufacturing an electronic device, includes preparing a first substrate including a first basement and a first conductive layer, and a second substrate includes a second basement and a second conductive layer, opposing the first conductive layer and spaced from the first conductive layer, providing a protection layer on the second substrate, forming a first hole penetrating the second substrate by irradiating the second substrate with a laser beam in a position overlapping the protection layer, removing the protection layer and forming a connecting material electrically connecting the first conductive layer and the second conductive layer to each other via the first hole after removing the protection layer.