Semiconductor Laser Driver Layout With Phase-Change Heat Buffering
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Solution Overview
Problem
Existing semiconductor laser driving apparatuses face an issue of increased size due to the installation of cooling fans, heat sinks, or heat pipes, which complicates the structure and may affect heat radiation efficiency.
Innovation Solution
A semiconductor laser driving apparatus with a substrate incorporating a laser driver and a semiconductor laser, connected via wiring with 0.5 nanohenries or less inductance, surrounded by side walls filled with heat storage materials like vanadium oxide or PCM sheets, and a diffusion plate for improved heat radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling fans, heat sinks, or heat pipes are installed to radiate heat, then heat radiation capability is improved, but device size increases
Solution Approach 1:
The patent combines the heat storage function and heat radiation function into a single integrated heat storage/radiation member. This member is formed by filling molten metal into a mold cavity, creating a unified structure that both stores thermal energy and radiates heat, eliminating the need for separate cooling components like fans, heat sinks, or heat pipes.
Solution Approach 2:
The patent utilizes the phase change parameter of metal materials (from solid to liquid and back) to achieve heat storage and radiation. By selecting metals with appropriate melting points and latent heat characteristics, the system efficiently manages thermal energy within a compact volume, resolving the contradiction between heat radiation capability and device size.
2Temperature
If complex cooling structures are installed, then heat management is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple cooling functions (heat absorption, heat storage, and heat radiation) into a single heat storage/radiation member. This integration simplifies the overall cooling structure by eliminating the need for multiple separate components and their associated mounting, control, and maintenance systems.
Solution Approach 2:
The heat storage/radiation member operates autonomously by utilizing the phase change properties of metal materials. The material automatically absorbs heat when molten and radiates heat when solidifying, without requiring external control mechanisms, sensors, or active management systems, thereby reducing device complexity.
3Reliability
If wiring length is reduced to decrease inductance, then electrical performance is improved, but manufacturing difficulty increases
Solution Approach 1:
The patent transitions from planar wiring layouts to three-dimensional vertical stacking, placing the laser driver, semiconductor laser, and heat storage/radiation member in different vertical layers. This spatial reconfiguration enables extremely short connection lengths while maintaining manufacturability through standard chip mounting and bonding techniques.
Solution Approach 2:
The patent implements a nested arrangement where the heat storage/radiation member is positioned directly beneath the semiconductor laser, which is mounted on the laser driver substrate. This nested configuration minimizes the distance between components and allows for compact integration using conventional semiconductor packaging and mounting processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces wiring inductance, enhances heat radiation, and maintains stable operation by preventing temperature rise, thus ensuring high-quality laser emission with a compact and efficient design.
Implementation Method 1
side walls having a heat storage material therein
Implementation Method 2
heat storage material
Implementation Method 3
semiconductor laser mounted on one surface of the substrate
Implementation Method 4
laser light
Implementation Method 5
connection wiring that electrically connects the laser driver and the semiconductor laser
Data Source
AI summary
An object of the present technique is to obtain excellent heat radiation characteristics with a simple structure in a semiconductor laser driving apparatus. A semiconductor laser driving apparatus includes a substrate, a laser driver, and a semiconductor laser. The substrate incorporates the laser driver. The semiconductor laser is mounted on one surface of the substrate. Connection wiring electrically connects the laser driver and the semiconductor laser to each other with a wiring inductance of 0.5 nanohenries or less. Side walls surround a region including the semiconductor laser on the surface of the substrate where the semiconductor laser is mounted. The side walls have a heat storage material therein.