Semiconductor Laser Driver Integration for Low-Inductance Wiring
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Solution Overview
Problem
The integration of laser diode arrays and driver ICs in optical modules results in significant wiring inductance, leading to distorted drive waveforms, particularly in ToF systems operating at high frequencies.
Innovation Solution
A semiconductor laser driving apparatus with a substrate incorporating a laser driver and semiconductor laser, connected via wiring inductance of 0.5 nanohenries or less, along with a temperature sensor and memory for storing control data, allowing precise drive current adjustment based on temperature and light intensity monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If laser diode array and driver IC are integrated in optical module, then integration is achieved, but wiring inductance increases causing drive waveform distortion
Solution Approach 1:
The patent merges the driver circuit and semiconductor laser into a single integrated chip, eliminating the need for external wiring connections. This integration approach maintains the benefits of compact design while reducing wiring inductance to negligible levels, thereby preventing drive waveform distortion that would otherwise occur in modular optical assemblies.
2Reliability
If wiring length is reduced to decrease inductance, then inductance is reduced, but manufacturing precision requirements increase
Solution Approach 1:
By integrating the driver circuit and laser diode onto the same chip substrate, the patent eliminates the need for precise external wiring connections. The electrical connections are formed through standard semiconductor fabrication processes during chip manufacturing, which inherently provide consistent and controlled trace lengths without requiring post-fabrication precision assembly.
3Stability of the object's composition
If temperature control is implemented to maintain laser performance, then laser power stability is improved, but device complexity increases
Solution Approach 1:
The integrated chip design allows the driver circuit to directly monitor and control the semiconductor laser's operating conditions without requiring external temperature control mechanisms. The close integration enables inherent thermal management through shared substrate and proximity, reducing the need for additional active cooling or heating components while maintaining stable laser output.
Data Source
AI summary
To reduce the wiring inductance between a semiconductor laser and a laser driver in a semiconductor laser driving apparatus. A substrate incorporates a laser driver. A semiconductor laser is mounted on one surface of the substrate of a semiconductor laser driving apparatus to emit irradiation light from an irradiation surface. Connection wiring electrically connects the laser driver and the semiconductor laser to each other with a wiring inductance of 0.5 nanohenries or less. A temperature sensor measures a temperature relating to the semiconductor laser. A memory stores control data from the laser driver to the semiconductor laser in a manner corresponding to the temperature.