Semiconductor Laser Driver Layout With PCM Sidewalls for Cooling
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Solution Overview
Problem
Existing semiconductor laser driving apparatuses face increased size issues due to the installation of cooling fans, heat sinks, or heat pipes, which complicates heat radiation.
Innovation Solution
A semiconductor laser driving apparatus with a substrate incorporating a laser driver and a semiconductor laser connected by low-inductance wiring (0.5 nanohenries or less) and side walls filled with heat storage materials, such as vanadium oxide or PCM sheets, to enhance heat radiation and reduce size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling fans, heat sinks, or heat pipes are installed for heat radiation, then heat radiation performance is improved, but device size increases
Solution Approach 1:
The patent combines multiple heat radiation mechanisms (conduction through substrate, convection via natural air flow, and radiation from heat dissipation portions) into a unified cooling system. The housing integrates heat dissipation portions directly into its structure, merging the housing function with heat radiation function, thereby achieving effective cooling without adding separate large cooling components.
Solution Approach 2:
The housing serves multiple functions: it provides mechanical protection, structural support, and heat radiation. The heat dissipation portions are integrated into the housing itself, allowing the housing to simultaneously perform enclosure and thermal management functions, eliminating the need for dedicated large cooling components.
2Temperature
If complex cooling systems are installed, then heat radiation is improved, but device complexity increases
Solution Approach 1:
The patent merges the cooling function into the existing housing structure rather than adding separate complex cooling systems. The heat dissipation portions are formed as integral parts of the housing, combining structural support and thermal management into a single unified design, thereby reducing overall system complexity.
3Reliability
If threshold current is reduced, then laser characteristics are improved, but temperature control becomes more critical
Solution Approach 1:
The patent implements preliminary heat dissipation measures by designing heat dissipation portions in advance within the housing structure. This proactive thermal management prevents temperature rise before it affects laser performance, allowing the use of lower threshold currents while maintaining stable operation.
Solution Approach 2:
The heat dissipation portions act as intermediary thermal management elements between the light emitting component and the surrounding environment. These portions facilitate efficient heat transfer from the laser to the housing and ultimately to the air, providing intermediate cooling that protects laser characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration promotes efficient heat radiation, maintains low temperature, and prevents temperature rise, ensuring high-quality laser emission characteristics while maintaining a simple structure.
Implementation Method 1
side walls having a heat storage material therein
Implementation Method 2
heat storage material
Implementation Method 3
cooling fan for blowing cooling air
Implementation Method 4
heat dissipation portions formed in the housing at positions surrounding the light emitting component in a plan view
Implementation Method 5
heat generated in the semiconductor laser driving apparatus is radiated by air
Data Source
Figure 1
Figure 2
Figure 3a~3c
AI summary
An object of the present technique is to obtain excellent heat radiation characteristics with a simple structure in a semiconductor laser driving apparatus. A semiconductor laser driving apparatus includes a substrate, a laser driver, and a semiconductor laser. The substrate incorporates the laser driver. The semiconductor laser is mounted on one surface of the substrate. Connection wiring electrically connects the laser driver and the semiconductor laser to each other with a wiring inductance of 0.5 nanohenries or less. Side walls surround a region including the semiconductor laser on the surface of the substrate where the semiconductor laser is mounted. The side walls have a heat storage material therein.