Laser Driver Thermal Via Layout for Stable Light Emission
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Solution Overview
Problem
The existing semiconductor laser driving apparatuses face challenges in heat dissipation due to low heat dissipation performance of the substrate, which leads to degradation of the light-emitting properties of the laser diode.
Innovation Solution
The semiconductor laser driving apparatus incorporates a substrate with a laser driver, a semiconductor laser, a connecting wire with low wiring inductance, and driver-side thermal vias that dissipate heat generated by the laser driver to the other face of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the laser driver is incorporated in the substrate to achieve integration, then the device complexity is reduced, but the heat dissipation performance deteriorates causing heat conduction to the laser diode
Solution Approach 1:
The substrate is divided into functionally distinct regions: a first region housing the laser driver and a second region housing the laser diode array. This spatial segmentation allows independent thermal management for each component, enabling the laser driver to dissipate heat away from the laser diode while maintaining integration benefits.
Solution Approach 2:
A heat dissipation structure is introduced as an intermediary element between the laser driver and the laser diode array. This mediator captures and redirects heat away from the laser diode, preventing harmful thermal conduction while allowing both components to remain integrated on the same substrate.
2Volume of moving object
If the laser driver is disposed close to the laser diode for compact design, then the device size is reduced, but the heat generated by the laser driver degrades the light-emitting property of the laser diode
Solution Approach 1:
Different regions of the substrate are assigned different thermal characteristics. The first region containing the laser driver is designed with enhanced heat dissipation capabilities, while the second region containing the laser diode array is designed to minimize heat absorption. This local differentiation allows compact integration while protecting the laser diode's light-emitting properties.
Solution Approach 2:
The heat dissipation structure serves as a thermal intermediary that selectively manages heat flow between closely spaced components. It allows the laser driver and laser diode array to be disposed near each other for compactness while preventing harmful thermal interaction through directed heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the heat dissipation performance of the semiconductor laser driving apparatus, preventing heat conduction to the semiconductor laser and maintaining its light-emitting properties.
Implementation Method 1
a driver-side thermal via that is disposed between the laser driver and an other face of the substrate, the driver-side thermal via dissipating heat generated by the laser driver to the other face
Data Source
AI summary
A light emitting device includes a first substrate, a light source on a first surface of the first substrate and that emits light toward an object, and a driver disposed in the first substrate and that drives the light source. The driver overlaps the light source in a plan view. The light emitting device includes at least one first via disposed in the first substrate and overlapping the driver in the plan view, and a first conductor on a second surface of the first substrate opposite the first surface and overlapping the light source, the driver, and the at least one first via in the plan view. The first conductor is connected to the at least one first via.