Dual-Side Imaging in Laser Processing for Semiconductor Line Alignment
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Solution Overview
Problem
Existing laser processing techniques struggle to make the state of a processing object recognizable on both sides of the laser irradiation position in the processing direction, particularly when the laser beam is moved relative to the processing object.
Innovation Solution
A laser processing apparatus and method that includes two imaging parts, one on each side of the laser irradiation position, to image respective ranges on both sides of the laser beam path, allowing for recognition of the processing object's state on both sides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If a single imaging part is used to image the processing object, then the device complexity is reduced, but the state of the processing object cannot be recognized on both sides of the laser irradiation position in the processing direction
Solution Approach 1:
The imaging function is segmented into two separate imaging parts: a first imaging part that images a first imaging range on one side of the laser irradiation position in the processing direction, and a second imaging part that images a second imaging range on the other side. This segmentation allows each imaging part to independently capture the state of the processing object on its respective side, thereby resolving the contradiction between complete state recognition and device complexity.
2Productivity
If the laser beam is moved relative to the processing object to process multiple processing lines, then the productivity is improved, but the position of the unprocessed processing line shifts in the feeding direction orthogonal to the processing direction
Solution Approach 1:
The imaging parts provide real-time feedback on the position and state of the processing object during laser processing. The control unit uses this feedback information to dynamically adjust the laser beam position and compensate for shifts in the unprocessed processing line, thereby maintaining manufacturing precision while processing multiple lines efficiently.
Solution Approach 2:
The imaging parts capture images of the processing object before, during, and after laser processing. This preliminary and continuous imaging allows the control unit to predict and compensate for position shifts before they affect processing accuracy, enabling precise multi-line processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective recognition of the processing object's state on both sides of the laser irradiation position, enhancing the precision and accuracy of laser processing by utilizing the imaging parts during switching periods.
Implementation Method 1
a first imaging part located on a first side in the processing direction with respect to the processing head and imaging a first imaging range located on the first side of the laser irradiation position; a second imaging part located on a second side opposite to the first side in the processing direction with respect to the processing head and imaging a second imaging range located on the second side of the laser irradiation position
Implementation Method 2
a processing head irradiating a laser beam to a predetermined laser irradiation position
Implementation Method 3
processing the processing line by performing a line processing of moving the laser irradiation position in the processing direction with respect to the processing object by the processing-axis driver while irradiating the laser beam to the laser irradiation position from the processing head
Data Source
AI summary
The imaging part (first imaging part) for imaging the imaging range (first imaging range) located on the (+X) side (first side) in the X direction (processing direction) relative to the laser irradiation position and the imaging part (second imaging part) for imaging the imaging range (second imaging range) located on the (−X) side (second side) in the X direction (processing direction) relative to the laser irradiation position are provided. The imaging parts image parts of the semiconductor substrate overlapping the respective imaging ranges. In this way, a state of the semiconductor substrate on both sides of the laser irradiation position in the X direction can be recognized.