Semiconductor Laser Electrode Layout for End-Surface Recognition

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Solution Overview

Problem

Existing methods for manufacturing semiconductor laser elements face challenges in accurately determining the position of the end surface due to the absence of electrode patterns on the end surface, leading to potential misclassification of good items as defective and risks of short circuits during cleavage.

Innovation Solution

The semiconductor laser element design includes a semiconductor-containing part with a specific arrangement of electrodes and metal films on the first main surface, spaced apart from the optical waveguide, allowing for precise determination of the light emitting end surface using image recognition and reducing the risk of short circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If electrode patterns are used for position determination, then image recognition can identify the end surface position, but electrode patterns may cause short circuits due to stretching during cleavage

Engineering Contradiction:

Improveend surface position determination precisionVSAvoidshort circuit risk

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The patent divides the functional roles by separating the position determination function from the electrical conduction function. Recognition marks (non-conductive) are placed at the end surface for precise position determination, while electrode patterns are kept away from the end surface to avoid short circuits during cleavage.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces recognition marks as intermediary elements that serve as mediators between the image recognition system and the actual end surface position. These marks provide a clear visual reference for position determination without involving the electrode patterns that could cause electrical issues.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Measurement precision

If electrode patterns are formed up to the cleaved end surface, then position determination is possible, but the electrode patterns may stretch and cause short circuits

Engineering Contradiction:

Improveend surface position determination precisionVSAvoidshort circuit due to electrode stretching

Core Design Contradiction:

Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the position determination function from the electrode patterns and assigns it to separate recognition marks. This allows the electrode patterns to be taken out from the critical end surface region, eliminating the harmful stretching effect while preserving the position determination capability through the dedicated recognition marks.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of placing conductive electrode patterns at the end surface for position determination, the patent inverts the approach by placing non-conductive recognition marks at the end surface. This inversion solves the short circuit problem while maintaining the position determination function.

Inventive Principle:

Principle #13The other way round (Inversion)

3Reliability

If no electrode pattern is present on the end surface, then short circuit risk is reduced, but it becomes impossible to determine the end surface position using image recognition

Engineering Contradiction:

Improveshort circuit preventionVSAvoidend surface position determination capability

Core Design Contradiction:

ReliabilityVSMeasurement precision

Solution Approach 1:

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent creates a visual copy or representation of the end surface position through recognition marks. These marks serve as a visual proxy that can be easily identified by image recognition systems, allowing position determination without requiring the actual electrode patterns to be present at the end surface.

Inventive Principle:

Principle #26Copying

Data Source

PatentUS12413042B2Semiconductor laser element, light emitting device, and method for manufacturing these

Publication Date: 2025.09.09 NICHIA CORP

AI summary

A semiconductor laser element includes a semiconductor-containing part, an electrode and at least one metal film. The semiconductor-containing part has first and second main surfaces, a light emitting end surface, a light reflecting end surface, and an optical waveguide. A distance between the first main surface and the optical waveguide is greater than a distance between the second main surface and the optical waveguide. The electrode is provided on the first main surface. The metal film is provided on the first main surface at a position spaced apart from the electrode. The metal film is in contact with a first side of an outer edge of the first main surface on a side of the light emitting end surface. The metal film is arranged at a position that does not overlap the optical waveguide in a plan view seen along a normal direction of the first main surface.