Semiconductor Laser Electrode Submount Resistance
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Solution Overview
Problem
Semiconductor laser devices with high electrical resistance in current paths limit the current supply to the laser element, preventing high laser output.
Innovation Solution
A semiconductor laser device design featuring an insulating heat sink with a conductive submount and electrodes, where the first electrode is connected to the side surface or a region of the submount, reducing electrical resistance and enabling a large current supply to the semiconductor laser element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional current path design is used with wire connections, then device structure is simple, but electrical resistance is high limiting current supply
Solution Approach 1:
The patent transitions from planar wire connections to a three-dimensional electrode-submount assembly where the first electrode contacts the side surface of the submount. This spatial dimensionality change creates additional current path routes, reducing electrical resistance and enabling higher current supply to achieve greater laser output.
Solution Approach 2:
The submount serves as an intermediary conductive component between the heat sink and the semiconductor laser element. By introducing this intermediate conductive structure with low electrical resistance, the patent establishes efficient current transmission paths that overcome the high resistance limitations of conventional direct wire connections.
2Power
If larger current is supplied to achieve high laser output, then laser output increases, but heat generation increases requiring improved cooling
Solution Approach 1:
The heat sink acts as an intermediary thermal management component between the semiconductor laser element and the external environment. This dedicated heat dissipation structure efficiently conducts away the heat generated by high-current operation, enabling sustained high laser output without excessive temperature rise.
3Reliability
If first electrode is positioned above heat sink, then current path resistance is reduced, but device structure becomes more complex
Solution Approach 1:
The submount performs multiple functions simultaneously: it serves as a mechanical support for the semiconductor laser element, provides a low-resistance current transmission path, and acts as a thermal management interface with the heat sink. This multi-functionality reduces the need for separate components, thereby limiting the increase in structural complexity despite the improved electrode positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces electrical resistance in the current paths, allowing for high-power laser output and efficient cooling of the semiconductor laser element.
Implementation Method 1
heat sink which is insulating and includes a flow channel for a coolant
Implementation Method 2
heat sink which is insulating and includes a flow channel for a coolant
Data Source
Figure 1~2
Figure 3~5
Figure 6~9
AI summary
A semiconductor laser device (1) includes a heat sink (20), a submount (30), a first electrode (60), an insulating layer (70), a semiconductor laser element (40), a connecting portion (50), and a second electrode (61). The submount (30) is conductive and on a first region (R1) of the upper surface of the heat sink (20). The first electrode (60) is conductive and on a second region (R2), different from the first region (R1), of the upper surface of the heat sink (20). The first electrode (60) is electrically connected either to at least part of a side surface of the submount (30) or to the upper surface of the submount (30).