Laser-Scanned Element Transfer for Precise Low-Stress Peeling
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Solution Overview
Problem
Existing element transfer devices face difficulties in easily peeling articles from adhesive layers due to the periphery of the peeled portion being in contact with the adhesive layer, leading to potential damage and scattering of transfer positions.
Innovation Solution
The element transfer device employs a laser light irradiation unit that controls the laser light irradiation position to start from one end of the element and move to the other, with a smaller spot area and intermittent irradiation, adjusting the pitch based on element fragility, and uses a control unit to manage positional deviation for precise transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If laser light is irradiated toward the center of the article, then the article is peeled from the center, but the periphery of the peeled portion remains in contact with the adhesive layer making it difficult to peel completely
Solution Approach 1:
The patent divides the laser irradiation process into multiple segments by moving the laser beam in a scanning motion across the adhesive layer from one end of the article to the other. This segmented approach ensures that the entire adhesive layer is treated, not just the center portion, enabling complete peeling of the article.
Solution Approach 2:
The patent introduces dynamic motion to the laser irradiation system, making the laser beam movable rather than stationary. The laser beam scans across the adhesive layer in a controlled manner, dynamically covering the entire area to achieve uniform heating and complete peeling of the article.
2Area of stationary object
If the laser spot area is large, then the irradiation covers more area, but the stress on fragile elements increases causing damage
Solution Approach 1:
The patent segments the irradiation area into multiple smaller laser spot positions that are scanned across the adhesive layer. This segmentation allows the total irradiation coverage to be large while keeping each individual laser spot small, thereby reducing stress on fragile elements while still achieving complete peeling.
Solution Approach 2:
The patent applies partial action by using a small laser spot that irradiates only a portion of the adhesive layer at any given moment. The laser then moves to irradiate adjacent portions, accumulating the total coverage area over time. This approach minimizes stress on elements during each irradiation step while achieving complete coverage through multiple partial irradiations.
3Productivity
If laser light is irradiated continuously, then the peeling process is fast, but the stress on fragile elements increases causing damage
Solution Approach 1:
The patent introduces dynamic motion to the laser irradiation system, scanning the laser beam rapidly across the adhesive layer. This dynamic scanning approach maintains high productivity by continuously moving the laser while distributing the thermal energy over a larger area over time, reducing peak stress on any single point and preventing element damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables easy peeling of elements with reduced damage and precise transfer positioning, minimizing scattering and stress on fragile elements.
Implementation Method 1
laser light is irradiated from an upper surface side of the substrate toward the adhesive layer, causing the adhesive layer to bulge downward in a convex shape
Data Source
AI summary
An element transfer device includes a support substrate holding part that holds a support substrate on which an element is supported via an adhesive layer, a laser light irradiation unit that is disposed on a side opposite to a surface on which the element is supported by the support substrate and irradiates laser light toward the support substrate, and a control unit that controls an irradiation position of the laser light irradiated from the laser light irradiation unit. An area of a spot area of the laser light is smaller than an area of a surface of the element supported by the support substrate. The control unit controls the irradiation position of the laser light such that the laser light is irradiated from one end side of the element to the other end side while moving relative to the support substrate.