Semiconductor Laser Element Production via Thermal Singulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for producing semiconductor laser elements face challenges in achieving efficient and precise production, particularly in aligning and singulating semiconductor laser diodes with high precision and throughput, which is crucial for effective optical coupling and cost reduction.
Innovation Solution
A method involving the use of a carrier composite with thermally conductive carriers, where a laser bar with semiconductor laser diodes is attached at elevated temperature and then cooled to induce predetermined breaking points, allowing for precise singulation and alignment of individual semiconductor laser elements, thereby increasing production efficiency and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If semiconductor laser diodes are attached to carriers individually with high precision alignment, then optical coupling precision is improved, but production throughput decreases and costs increase
Solution Approach 1:
The method segments the production process into two phases: first, simultaneous attachment of multiple laser diodes to a carrier composite at lower precision requirements; second, subsequent precise positioning and alignment of each diode relative to its carrier. This segmentation allows high-volume attachment followed by high-precision adjustment, resolving the contradiction between throughput and precision.
Solution Approach 2:
The carrier composite is prepared in advance with predetermined breaking points and attachment structures. Multiple laser diodes are attached simultaneously to the carrier composite before final alignment, performing preliminary positioning that enables subsequent precise adjustment without requiring perfect initial alignment, thus improving both throughput and precision.
2Adaptability or versatility
If laser bars are singulated into individual diodes before attachment to carriers, then alignment flexibility is improved, but mechanical stability during handling decreases
Solution Approach 1:
The invention implements a nested structure where individual laser diodes are attached to carriers, which are themselves attached to a carrier composite. This nested arrangement provides mechanical stability at multiple levels: the carrier composite stabilizes during handling and transport, while individual carriers provide stability during alignment, enabling both mechanical strength and alignment flexibility.
Solution Approach 2:
The method separates the attachment dimension from the alignment dimension. Laser diodes are attached to carriers in a first dimension (bulk attachment for stability), then positioned and aligned in a second dimension (precise adjustment for flexibility). This dimensional separation resolves the contradiction between mechanical stability and alignment flexibility.
3Manufacturing precision
If predetermined breaking points are generated on growth substrate before attachment, then singulation precision is improved, but substrate integrity during attachment decreases
Solution Approach 1:
The growth substrate is reinforced with a carrier composite structure before the breaking operation. The carrier composite acts as a cushioning support that distributes mechanical stresses during the generation of predetermined breaking points, preventing substrate damage while enabling precise singulation. After attachment, the carriers provide continued support to maintain substrate integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise alignment and singulation of semiconductor laser elements, enhancing optical coupling and reducing production costs by increasing throughput and allowing for simultaneous positioning of multiple diodes relative to the carrier composite, thus addressing the challenges of precision and efficiency in semiconductor laser element production.
Implementation Method 1
The laser bar is attached to a carrier upper side of the carrier composite at an elevated temperature compared to room temperature... In comparison with the attachment, a temperature of the laser bar and of the carrier composite is reduced... precisely one predetermined breaking point is formed in each singulation region which separates adjacent semiconductor laser diodes from one another
Data Source
AI summary
Method for producing semiconductor laser elements (1) comprises A) providing a carrier composite (20) having a plurality of carriers (2) for the semiconductor laser elements (1), B) providing a laser bar (30) having a plurality of semiconductor laser diodes (3) which comprise a common growth substrate (31) and a semiconductor layer sequence (32) grown thereon, C) generating predetermined breaking points (35) on a substrate underside (34) of the growth substrate (31), said substrate underside facing away from the semiconductor layer sequence (32), D) attaching the laser bar (30) to a carrier upper side (23) of the carrier composite (20), wherein the attachment is performed at an elevated temperature and is followed by cooling, and E) singulating into the semiconductor laser elements (1), wherein steps B) to E) are performed in the indicated sequence.