Laser-Embedded Interconnects for High-Density IC Substrates
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Solution Overview
Problem
Current semiconductor packaging methods, such as multi-layer substrates, are costly and thick, limiting interconnect density and conductor spacing, which is undesirable for high-density integrated circuits like VLSI circuits.
Innovation Solution
A substrate with laminated layers is created by applying thin-film dielectric sheets to a prepared substrate, using laser-embedding to form conductive patterns beneath the surface, and then plating or screening conductive material into channels within these layers, allowing for a high conductor density without the cost and thickness of traditional multi-layer substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional multi-layer substrates are used to increase interconnect density, then conductor density is improved, but substrate thickness and manufacturing cost increase
Solution Approach 1:
The patent transitions from traditional planar multi-layer substrate construction to a three-dimensional laser-embedded conductor approach. Conductors are embedded within the substrate thickness dimension through laser drilling and plating, rather than only adding horizontal layers, thereby increasing conductor density without proportionally increasing overall substrate thickness.
Solution Approach 2:
The patent replaces traditional mechanical drilling and chemical etching methods with laser-based drilling and embedding. The laser drilling process creates precise channels for conductor embedding more efficiently, reducing both substrate thickness requirements and manufacturing complexity while achieving higher conductor density.
2Quantity of substance
If traditional multi-layer substrates are used to increase interconnect density, then conductor density is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces complex mechanical multi-layer stacking and alignment processes with a streamlined laser-based embedding process. The laser drilling and in-situ plating eliminate multiple fabrication steps, reducing manufacturing complexity and cost while achieving high conductor density.
Solution Approach 2:
The patent changes the manufacturing approach from adding multiple thick dielectric layers to embedding conductors within a single or fewer substrate layers. This parameter change in the fabrication process reduces material usage, simplifies assembly, and lowers overall manufacturing cost while maintaining high interconnect density.
3Quantity of substance
If laser-embedding is used to create conductive patterns, then interconnect density increases, but process complexity increases
Solution Approach 1:
The patent replaces multiple sequential mechanical fabrication steps with a integrated laser-based process. The laser performs drilling, heating, and facilitates plating in a single system, consolidating complex processes into one unified tool that reduces overall process complexity despite the advanced technology involved.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a thin, low-cost substrate with increased interconnect density and reduced inter-conductor spacing, achieving high conductor density while maintaining electrical integrity at a lower incremental cost.
Implementation Method 1
laser-embedding is used to generate a circuit pattern within the one or more thin-film dielectric sheets in order to embed conductors in channels beneath the surface
Implementation Method 2
Conductive material is then plated or paste screened into the channels
Data Source
AI summary
A method for making an integrated circuit substrate having laminated laser-embedded circuit layers provides a multi-layer high-density mounting and interconnect structure for integrated circuits. A prepared substrate, which may be a rigid double-sided dielectric or film dielectric with conductive patterns plated, etched or printed on one or both sides is laminated with a thin-film dielectric on one or both sides. The thin-film is laser-ablated to form channels and via apertures and conductive material is plated or paste screened into the channels and apertures, forming a conductive interconnect pattern that is isolated by the channel sides and vias through to the conductive patterns on the prepared substrate. An integrated circuit die and external terminals can then be attached to the substrate, providing an integrated circuit having a high-density interconnect.