Laser Emitter Module Thermal Management and Hermetic Sealing
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Solution Overview
Problem
Existing methods for packaging laser emitter bars face challenges in efficient heat dissipation and hermetic sealing, particularly in applications requiring precise optical alignment and reliable operation, where conventional cooling systems are elaborate and costly, and epoxy adhesive mounting can contaminate the system due to outgassing.
Innovation Solution
The proposed solution involves a housing with a heat sink spacer and heatsink configuration, using thermally conductive and electrically insulative materials to isolate the laser emitter bar from the housing, along with a fast axis collimator for beam collimation and a ferrule assembly for optical fiber alignment, ensuring efficient heat dissipation and hermetic sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy adhesive mounting is used to mount optical components in a hermetically sealed unit, then the assembly can be hermetically sealed, but outgassing from the epoxy material may contaminate the system or optics within the system
Solution Approach 1:
The patent removes the epoxy adhesive material from the hermetically sealed enclosure entirely, eliminating the source of outgassing contamination. Optical components are mounted using mechanical means (screws, clips, or bonding to metal surfaces) that do not involve organic adhesives, thus extracting the harmful element while preserving hermetic sealing capability.
Solution Approach 2:
The patent introduces metal surfaces (aluminum or copper heat sinks, stainless steel housing) as intermediary mounting surfaces for optical components. These metal surfaces provide both mechanical support and thermal conduction without introducing organic materials that outgas, serving as a clean intermediary between the mounting structure and optical components.
2Temperature
If laser emitter bars are spaced far apart to allow sufficient cooling, then heat dissipation is improved, but the device size and complexity increase
Solution Approach 1:
The patent merges the cooling function with the structural housing by making the housing itself thermally conductive (aluminum or copper). The housing serves dual purposes: mechanical enclosure and heat dissipation pathway, eliminating the need for separate elaborate cooling systems while maintaining effective thermal management.
Solution Approach 2:
The housing structure performs self-service by simultaneously providing mechanical support, thermal conduction, and heat dissipation. The thermally conductive housing naturally conducts heat away from laser emitter bars through its structure, requiring no additional active cooling components or complex thermal management systems.
3Temperature
If thermally conductive materials are used to dissipate heat from laser emitter bars, then heat dissipation is improved, but electrical isolation between the emitter bar and housing may be compromised
Solution Approach 1:
The patent employs composite material structures where thermally conductive surfaces (aluminum or copper heat sinks) are electrically isolated from the housing through non-conductive bonding layers or insulation. This creates a composite assembly that achieves both thermal conduction and electrical isolation simultaneously, resolving the contradiction between heat dissipation and electrical safety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables reliable and cost-effective packaging of laser emitter bars with efficient heat dissipation and hermetic sealing, maintaining optical alignment and system reliability, even in applications where hermetic sealing is critical.
Implementation Method 1
A layer of thermally conductive and electrically insulative material is disposed between the laser emitter bar and the base of the housing so as to electrically isolate the laser emitter bar from the housing
Implementation Method 2
a heatsink is secured to a top surface of the heat sink spacer
Implementation Method 3
heatsink configuration, using thermally conductive and electrically insulative materials to isolate the laser emitter bar from the housing
Implementation Method 4
A fast axis collimator is mounted to the optical substrate adjacent an output surface of the laser emitter bar and is configured to substantially collimate the output of the laser emitter bar in a fast axis direction
Data Source
AI summary
Embodiments are directed to laser emitter modules and methods and devices for making the modules. Some module embodiments are configured to provide hermetically sealed enclosures that are convenient and cost effective to assemble and provide for active alignment of optical elements of the module.