Semiconductor Laser End-Surface Transfer for Higher Yield
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Solution Overview
Problem
Existing manufacturing methods for semiconductor laser devices face challenges in achieving high yield and precise formation of end surfaces, particularly due to the need for precise alignment and cleavage of support substrates.
Innovation Solution
A method involving the preparation of a semiconductor substrate with stripe-shaped semiconductor parts, division of structures to expose end surfaces parallel to the lateral direction, transfer of individual bodies to a second substrate, and subsequent division of the second substrate to form element substrates, thereby improving yield and reducing contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the conventional method of bonding element structure wafer to support substrate and then cleaving is used, then the laser element can be obtained with support substrate, but the manufacturing yield is reduced due to the need for precise alignment and cleavage of support substrates
Solution Approach 1:
The invention segments the manufacturing process into two independent stages: first forming individual bodies with end surfaces on a first substrate, then transferring them to a second substrate for final device assembly. This segmentation eliminates the need for precise alignment and cleavage of support substrates, as the individual bodies are already pre-formed with accurate end surfaces before transfer, thereby resolving the contradiction between manufacturing precision and productivity
Solution Approach 2:
The invention performs preliminary formation of end surfaces on individual bodies while they are still on the first substrate, before transfer to the second substrate. This preliminary action ensures that the critical end surface geometry is established with high precision in a controlled environment, eliminating the need for subsequent alignment and cleavage operations on support substrates, thus improving both precision and yield
2Manufacturing precision
If precise alignment and cleavage of support substrates is performed, then the end surfaces can be formed, but the process complexity increases and contamination risks arise
Solution Approach 1:
The invention separates the end surface formation process from the support substrate handling by forming individual bodies with end surfaces on a first substrate, then transferring them to a second substrate. This segmentation eliminates complex alignment and cleavage steps on support substrates, reducing process complexity while maintaining end surface precision through the controlled formation process on the first substrate
Solution Approach 2:
The invention extracts the critical end surface formation process from the support substrate manipulation sequence. By forming individual bodies with precise end surfaces on a first substrate before transfer, the complex alignment and cleavage operations on support substrates are eliminated, simplifying the overall process while preserving end surface quality
Data Source
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AI summary
A method includes preparing a semiconductor substrate including a first substrate and a plurality of semiconductor parts having a stripe shape and obtained by crystal growth on the first substrate, dividing each of a plurality of structures including a respective one of the plurality of semiconductor parts on the first substrate in a manner that an end surface parallel to a lateral direction is exposed at each structure and thus obtaining an individual body group, transferring a plurality of individual bodies included in the individual body group to a second substrate, and dividing the second substrate and thus obtaining each of a plurality of element substrates including a respective one or more of the plurality of individual bodies.