Laser Inspection Tool for EUV Vessel Surface Profiling
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Solution Overview
Problem
Target material accumulation on the interior surfaces of EUV radiation sources in semiconductor processing systems leads to reduced performance, increased downtime, and defective wafers, as existing inspection methods are inefficient and time-consuming.
Innovation Solution
An inspection tool with a laser-scanning system and motor system is inserted into the vessel to generate accurate three-dimensional profiles of interior surfaces, allowing for efficient scanning and rapid detection of target material accumulation, reducing downtime and increasing productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If existing inspection methods are used to detect target material accumulation, then the inspection can be performed, but the evaluation time is excessively long and the process is inefficient
Solution Approach 1:
The patent replaces manual inspection methods with an automated laser scanning system that uses optical fields to detect target material accumulation. The laser scanner projects laser lines onto the interior surface and captures reflected light patterns, substituting mechanical/manual inspection with optical field-based automated detection, thereby dramatically reducing evaluation time and improving inspection efficiency
Solution Approach 2:
The patent creates a three-dimensional digital model (copy) of the interior surface by processing laser scanning data. This digital replica allows for rapid analysis and comparison to detect target material accumulation without requiring physical inspection of the actual interior surface, significantly reducing evaluation time while maintaining high productivity
2Device complexity
If manual inspection methods are used, then the process is simple, but the downtime of the semiconductor processing system increases
Solution Approach 1:
The patent replaces simple manual inspection with an automated optical inspection system using laser scanning. Although this increases device complexity, it dramatically reduces system downtime by enabling rapid, automated detection of target material accumulation, allowing the semiconductor processing system to return to production faster
Solution Approach 2:
The patent performs preliminary inspection of the interior surface for target material accumulation before the accumulation causes performance degradation or defects. This advance detection allows for timely maintenance scheduling, reducing unplanned downtime and keeping the semiconductor processing system operational longer between maintenance cycles
3Measurement precision
If comprehensive inspection of interior surfaces is performed, then detection accuracy improves, but inspection time increases
Solution Approach 1:
The patent uses periodic pulsed laser scanning to inspect the interior surface. The laser scanner emits rapid successive laser pulses that scan different regions of the interior surface in a systematic periodic sequence. This periodic action enables comprehensive coverage with high detection accuracy while maintaining short total inspection time, as the system efficiently alternates between scanning and data processing
Solution Approach 2:
The patent transitions from two-dimensional surface inspection to three-dimensional volumetric scanning of the interior surface. By capturing depth information through laser time-of-flight or phase-shift measurements, the system achieves comprehensive detection of target material accumulation in all spatial dimensions, improving measurement precision without proportionally increasing inspection time due to efficient 3D point cloud processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The inspection tool significantly reduces evaluation times for target material accumulation, minimizing downtime and enhancing the productivity and throughput of semiconductor processing systems.
Implementation Method 1
a laser-scanning system supported by a frame, where the laser-scanning system generates scans of a portion of an interior surface of the vessel
Implementation Method 2
generate accurate three-dimensional profiles of interior surfaces
Data Source
AI summary
Some implementations described herein provide techniques and apparatuses for inspecting interior surfaces of a vessel of a radiation source for an accumulation of a target material. An inspection tool, including a laser-scanning system and a motor system supported by an elongated supported member, may be inserted into the vessel to generate an accurate three-dimensional profile of the interior surfaces. Use of the inspection tool is efficient, with short setup and scan times that substantially reduce a duration associated with evaluating the interior surfaces of the vessel for the accumulation.