Laser-Excised Capacitor Electrode to Minimize Debris and Aluminum Exposure
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Solution Overview
Problem
Existing capacitor manufacturing processes using mechanical die punching to excise sintered aluminum anodes result in conductive debris and exposure of raw aluminum to electrolyte, leading to inferior capacitor performance and increased manufacturing complexity.
Innovation Solution
The method involves sintering electrode material onto a substrate, excising the sintered portion using a femtosecond laser that cuts through the substrate around the periphery of the sintered portion without cutting the sintered material, and assembling the electrodes into a capacitor case with electrolyte.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical die punching is used to excise sintered aluminum anodes, then manufacturing simplicity is maintained, but conductive debris is generated and raw aluminum is exposed to electrolyte leading to inferior capacitor performance
Solution Approach 1:
The patent replaces mechanical die punching with laser excising technology. The laser beam precisely cuts through the substrate around the periphery of the sintered portion without cutting the sintered material itself, eliminating mechanical contact and conductive debris generation while maintaining manufacturing efficiency
Solution Approach 2:
The patent introduces a substrate as an intermediary layer between the sintered electrode material and the excising process. The laser cuts through the substrate rather than directly contacting the sintered aluminum, preventing raw aluminum exposure and conductive debris while the substrate serves as a protective barrier during manufacturing
2Ease of manufacture
If mechanical die punching is used to excise sintered aluminum anodes, then manufacturing simplicity is maintained, but manufacturing complexity increases due to debris management
Solution Approach 1:
The patent replaces mechanical die punching with laser excising technology. The laser beam precisely cuts through the substrate around the periphery of the sintered portion without cutting the sintered material itself, eliminating mechanical contact and conductive debris generation while maintaining manufacturing efficiency
Solution Approach 2:
The patent extracts only the necessary cutting function from the mechanical punching process by using laser technology to cut through the substrate around the periphery of the sintered portion. This selective excising removes the harmful mechanical contact while preserving the essential shape-defining function, simplifying debris management
3Manufacturing precision
If femtosecond laser is used to excise sintered portions, then manufacturing precision and performance are improved, but manufacturing cost increases
Solution Approach 1:
The patent applies local quality by using laser excising only at the periphery of the sintered portions where precise cutting is needed, rather than applying mechanical punching across the entire electrode. This localized precision approach maintains manufacturing quality while reducing overall process complexity and cost
Solution Approach 2:
The patent changes the excising method from mechanical to optical (laser), and specifically uses femtosecond laser parameters with pulse durations of 222-500 femtoseconds, frequencies of 250-500 kHz, and power densities of 5.74×10^5 W/cm2-5.74×10^6 W/cm2. These parameter optimizations balance precision requirements with manufacturing cost considerations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes conductive debris generation, reduces exposure of raw aluminum, and improves long-term capacitor charge time stability, while enabling the production of capacitors with complex shapes and reduced manufacturing costs.
Implementation Method 1
excising includes using a femtosecond laser to cut through the substrate
Implementation Method 2
forming a sintered electrode by sintering electrode material onto a portion of a first side of a substrate
Data Source
AI summary
A method of constructing a capacitor can include forming a sintered electrode by sintering electrode material onto a portion of a first side of a substrate; and excising the sintered portion from the substrate by cutting through the substrate around a periphery of the sintered portion, without cutting the sintered portion, wherein excising includes using a femtosecond laser to cut through the substrate.


