Laser Exposure of Contacting Device in Portable Data Carrier
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for exposing contacting devices in portable data carriers, such as chip cards, often result in material thickness weakening, risk of breakage, mechanical damage, poor adhesion of conductive materials, and tool wear due to milling processes.
Innovation Solution
A method involving mechanical formation of a recess followed by laser exposure to roughen the contacting device surface without damaging it, ensuring improved adhesion of electrically conductive materials and minimizing tool wear by avoiding contact with the metallic contacting device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a milling tool is used to expose the contacting device, then the contacting device can be exposed, but the material thickness is weakened and the risk of breakage increases
Solution Approach 1:
The patent replaces the mechanical milling process with a laser-based process to expose the contacting device. The laser removes material through ablation rather than mechanical cutting, eliminating the need for the milling tool to contact the metal contacting device. This substitution prevents mechanical damage, material thickness weakening, and tool wear while maintaining precise exposure of the contacting device.
Solution Approach 2:
The patent changes the physical state and properties of the laser beam parameters (energy, pulse duration, wavelength) to achieve selective removal of the insulating layer without damaging the metal contacting device. By controlling laser parameters, the process removes only the insulation material while leaving the contacting device intact, thereby maintaining material thickness and preventing breakage.
2Manufacturing precision
If the milling tool contacts the metallic contacting device, then the contacting device can be exposed, but the tool wears out quickly
Solution Approach 1:
The patent replaces the mechanical milling tool with a laser beam for exposing the contacting device. Since the laser is a non-contact process, the tool (laser beam) does not physically contact or wear against the metal contacting device. This eliminates tool wear and extends manufacturing process durability while maintaining precise exposure capability.
3Manufacturing precision
If the contacting device surface is smooth after milling, then the exposing process is complete, but the adhesion of electrically conductive material is poor
Solution Approach 1:
The patent changes the surface properties of the contacting device by using laser ablation to create a roughened surface texture. The laser parameters are controlled to remove the insulating layer and simultaneously create surface roughness features that increase the surface area and provide mechanical interlocking for the electrically conductive material, thereby improving adhesion strength.
Solution Approach 2:
The laser process creates a porous or rough surface structure on the contacting device. This porous/rough surface provides increased surface area and mechanical anchoring points for the electrically conductive material, enhancing adhesion. The surface morphology is deliberately modified to have micro-roughness that improves bonding.
4Manufacturing precision
If the milling process is used, then the contacting device can be exposed, but mechanical damage such as tearing and smearing occurs
Solution Approach 1:
The patent replaces the mechanical milling system with a laser ablation system. The laser removes material through thermal vaporization and ablation rather than mechanical cutting forces. This non-contact process eliminates mechanical damage such as tearing, smearing, and deformation of the contacting device while achieving precise exposure.
Solution Approach 2:
The laser process utilizes phase transitions of the insulating material (from solid to vapor through rapid heating and ablation). The laser energy causes the insulating material to undergo phase change and be removed as vapor, leaving the metal contacting device unaffected. This phase transition mechanism enables clean removal without mechanical contact and associated damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the adhesion between the contacting device and conductive materials, reduces the risk of breakage, and minimizes tool wear, while maintaining a stable contacting device structure.
Implementation Method 1
the contacting device is exposed in the recess by means of a laser. This is done in such a way that the surface of the contacting device is roughened.
Data Source
Figure 1~2
Figure 3~6
Figure 7~10
AI summary
The method involves exposing the contacting device in the recess by a laser, such that the surface of the contacting device is roughened. The recess is formed in the data carrier body (12) to a depth, such that a minimum thickness of the data carrier body covers the contacting device. The contacting device is exposed by a laser, such that it is partially undercut. An electrically conductive substance, particularly silver paste is introduced into the recess after the exposure of the contacting device, such that the contacting device is contacted by the electrically conductive substance. Independent claims are included for the following: (1) a method for manufacturing a portable data carrier; and (2) a portable data carrier comprises a data carrier body with an electrical component and an electronic module.