Edge-Emitting Semiconductor Laser Facet Encapsulation and Beam Redirection
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Solution Overview
Problem
Semiconductor lasers face inefficiencies and damage due to environmental influences, such as particle deposition and overheating, which are not adequately addressed by existing technologies that require hermetically sealed housings and complex installations.
Innovation Solution
A semiconductor laser design featuring an edge-emitting laser diode with an optical element that changes the laser radiation's propagation direction, encapsulated by a connecting material and molded body, allowing operation in a normal atmosphere without additional gas-tight encapsulation, reducing installation space and protecting against environmental influences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the laser diode is left exposed to the environment, then the installation space and device complexity are reduced, but particle deposition and environmental damage occur on the facet
Solution Approach 1:
A thin transparent encapsulation layer is applied over the facet to protect it from particle deposition while allowing laser radiation to pass through. This thin film provides environmental protection without significantly increasing device volume or blocking the optical path.
Solution Approach 2:
A transparent protective layer acts as an intermediary between the facet and the environment, preventing direct contact with harmful particles while maintaining optical transparency. This mediator layer enables the facet to be protected without requiring a bulky hermetic seal.
2Reliability
If a hermetically sealed housing is used to protect the laser diode, then reliability against environmental influences is improved, but device complexity and installation space increase
Solution Approach 1:
Instead of a complex hermetic housing, a thin transparent encapsulation layer directly covers the facet, providing environmental protection with minimal structural complexity and space requirements.
Solution Approach 2:
The protective function is extracted from a bulky hermetic housing and implemented as a thin transparent layer directly on the facet, removing unnecessary structural complexity while maintaining protection.
3Reliability
If the optical element completely covers the facet, then protection against environmental influences is improved, but heat dissipation from the facet becomes more difficult
Solution Approach 1:
A thin transparent encapsulation layer provides protection while maintaining thermal conductivity, allowing heat to dissipate through the thin film without significant thermal resistance.
Solution Approach 2:
The encapsulation layer is made from materials that combine optical transparency with good thermal conductivity, enabling simultaneous protection and heat dissipation functions.
4Reliability
If the connecting material completely covers the facet, then hermetic encapsulation is improved, but the radiation exit area becomes blocked
Solution Approach 1:
The encapsulation structure has different properties in different areas: the connecting material provides hermetic sealing around the periphery while the central radiation exit area remains transparent and unobstructed for laser transmission.
Solution Approach 2:
The facet coverage is segmented into different functional zones: a peripheral sealing region covered by connecting material for hermetic protection and a central transmission region left clear for laser radiation to pass through.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the semiconductor laser's efficiency by reducing beam divergence, preventing particle deposition, and facilitating heat dissipation, thereby improving reliability and reducing manufacturing and installation costs while simplifying integration with downstream optics.
Implementation Method 1
The optical element is designed to change the main propagation direction of the laser radiation entering the optical element during operation
Implementation Method 2
The connecting material can include an inorganic material such as glass or metal... The optical element may have a high thermal conductivity
Data Source
AI summary
The invention relates to a semiconductor laser including a carrier, an edge-emitting laser diode which is arranged on the carrier and which has an active zone for generating laser radiation and a facet with a radiation exit area, an optical element which covers the facet, a connecting material which is arranged between the optical element and the facet, a molded body which covers the laser diode and the optical element at least in places, wherein the optical element is at least partially transparent to the laser radiation emitted by the laser diode during operation, and the optical element is designed to change the main propagation direction of the laser radiation entering the optical element during operation.