Laser Processing Field Alignment for Accurate 3D Surface Machining
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Solution Overview
Problem
In laser processing of 3D surfaces, existing methods struggle to accurately align and process components due to material-specific deviations between CAD designs and real components, leading to inaccuracies and incomplete processing of large or complex components with multiple processing fields.
Innovation Solution
A method and system that utilize a processing head with a movable laser and optical recording device, controlled by a controller that adjusts processing coordinates based on real-time image data to correct for deviations, allowing precise processing across multiple fields without offsets, and includes a suction device to manage gases and ensure quality control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If best-fit alignment methods are used to align measured surfaces with CAD surfaces, then alignment can be performed, but accuracy is limited to the same level as the deviations (several millimeters)
Solution Approach 1:
The workpiece surface is divided into multiple processing fields that are processed separately. Each field is measured and corrected independently, allowing for localized high-precision alignment rather than relying on global best-fit methods. This segmentation enables accurate processing even when overall workpiece deviations are large.
Solution Approach 2:
The system measures the actual workpiece surface, compares it with CAD data, calculates correction values for deviations, and applies these corrections to processing coordinates. This closed-loop feedback mechanism continuously refines alignment accuracy, transforming millimeter-level deviations into sub-millimeter processing precision.
2Area of stationary object
If multiple processing fields are used to process large components, then large workpieces can be processed, but offsets and inaccuracies occur at field boundaries
Solution Approach 1:
Correction values are calculated for each processing field based on actual measurements, and these corrections are applied to ensure seamless continuity at field boundaries. The feedback loop detects and compensates for boundary offsets, maintaining precision across the entire large workpiece surface.
Solution Approach 2:
The system performs preliminary measurement and calculation of correction values for all processing fields before actual processing begins. This preliminary alignment ensures that when multiple fields are processed sequentially, they will join without offsets or inaccuracies at boundaries.
3Productivity
If the focal point is not kept within tolerance, then processing can proceed faster, but process stability decreases and removal becomes inconsistent
Solution Approach 1:
The system dynamically adjusts processing parameters including focal point position based on real-time measurements and corrections. By continuously adapting the focal point location to match actual surface geometry, the system maintains optimal processing conditions throughout the workpiece, ensuring both stability and consistent material removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances process stability, enables precise processing of large components with multiple fields, and minimizes deviations between CAD designs and real components, ensuring accurate and seamless processing while maintaining a stable focal point and quality control.
Implementation Method 1
processing a surface of a workpiece by means of a laser processing process
Implementation Method 2
processed by means of a laser beam, for example with a fixed parameter set of the laser pulses
Implementation Method 3
an optical recording device, for example various cameras or camera systems
Data Source
AI summary
A method for controlling a laser processing process on a surface of a workpiece. The method is implementable in conjunction with a processing system. The method includes: bringing about a relative movement between the processing head and the workpiece by the second movement device in order to arrange the processing head in a first processing field of the workpiece; triggering a recording of image data of the processing field by the optical acquisition device; correcting predefined processing coordinates using correction values in order to produce corrected processing coordinates, the correction values being determined in comparison with the predefined processing coordinates using image coordinates; controlling the laser and the first movement device using the corrected processing coordinates in order to process the processing field; and bringing about a further relative movement between the processing head and the workpiece in order to arrange the processing head in a second processing field.