Laser Filamentation Dicing for Deformation-Free Optical Singulation
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Solution Overview
Problem
Current systems for processing optical devices with sub-micron critical dimensions on substrates are throughput-limited and prone to deformation during handling and separation, requiring methods to enhance processing efficiency and prevent damage.
Innovation Solution
A laser dicing system with a two-part process using filamentation and singulation stages, where substrates are processed simultaneously with multiple laser beams and a substrate support assembly that retains devices without contact, utilizing a conveyor system and robot for high-throughput automation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional handling and separation methods are used for optical devices on substrates, then the devices can be separated from substrates, but the devices are prone to deformation and damage during handling and separation
Solution Approach 1:
The patent replaces traditional mechanical handling and separation methods with a laser-based system. The laser filamentation process creates controlled plasma channels through the substrate, enabling separation without mechanical contact with the optical devices. This substitution eliminates the deformation and damage caused by mechanical handling while maintaining effective separation capability.
Solution Approach 2:
The patent introduces laser-induced plasma filaments as an intermediary mechanism for substrate separation. Instead of directly mechanically separating devices from substrates, the laser creates plasma channels that act as a mediator to facilitate clean separation. This intermediary process protects the optical devices from direct mechanical stress while achieving the desired separation.
2Productivity
If multiple processing stations are used for substrate processing, then various processing steps can be performed, but the system is throughput-limited due to the number of stations and handling requirements
Solution Approach 1:
The patent merges multiple processing functions into a single integrated laser dicing system. The system combines filamentation, singulation, and device separation capabilities in one station, eliminating the need for multiple separate processing stations. This consolidation maintains full processing functionality while dramatically improving throughput by removing bottlenecks associated with sequential station handling.
Solution Approach 2:
The laser dicing system is designed with multi-functionality to perform various processing steps including filamentation, singulation, and separation within a single platform. This universal system can handle different substrate types and processing requirements without requiring dedicated stations for each function, thereby increasing overall productivity while reducing system complexity.
3Manufacturing precision
If careful handling is used for substrates with sub-micron critical dimensions, then device deformation is minimized, but processing throughput is reduced
Solution Approach 1:
The patent replaces mechanical handling methods with laser-based filamentation and plasma channel creation. This substitution allows precise processing of substrates with sub-micron critical dimensions without the deformation risks associated with mechanical contact. The laser process maintains manufacturing precision while enabling higher throughput through automated, contactless processing.
Solution Approach 2:
The laser filamentation process is self-guiding through the substrate, creating precise plasma channels without requiring mechanical positioning or contact. The laser beam inherently follows the programmed path through the substrate, providing self-service precision processing that maintains sub-micron accuracy while operating at high speeds, thus improving throughput without sacrificing manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables efficient, high-throughput processing of optical devices with reduced risk of deformation, allowing for precise separation and handling of substrates with sub-micron features without defects, enhancing manufacturing efficiency and product quality.
Implementation Method 1
One or more device contours are scribed on the first substrate in the filamentation stage
Implementation Method 2
a first laser beam from a first laser source toward the first stage
Implementation Method 3
The first substrate is cut along one or more device contours in the singulation stage
Implementation Method 4
a second laser beam from a second laser source toward the second stage
Data Source
AI summary
A process of producing optical devices is provided including transferring a first substrate comprising one or more devices to a laser dicing tool, the laser dicing tool including a filamentation stage and a singulation stage. One or more device contours are created on the first substrate in the filamentation stage. The optical devices are singulated from the first substrate along the one or more device contours in the singulation stage. The devices are transferred to storage or for further backend processing.