Laser Absorbing Film Control for Reliable Substrate Separation
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Solution Overview
Problem
Existing substrate processing systems face challenges in effectively separating a first substrate from a second substrate due to insufficient energy absorption by a thin laser absorbing layer, leading to incomplete edge trimming.
Innovation Solution
A substrate processing apparatus is designed with a laser absorbing film and a separation facilitating film, allowing for controlled laser radiation to select the separation surface between the substrates, ensuring appropriate separation even with varying film thicknesses by adjusting the radiation interval of the laser light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a thin laser absorbing film is used, then the device structure is simplified and manufacturing is easier, but the film cannot absorb sufficient laser energy leading to incomplete separation
Solution Approach 1:
The patent introduces a laser absorbing film as an intermediary layer between the first substrate and second substrate. This mediator absorbs laser energy and converts it to thermal energy, enabling controlled separation at the interface without requiring direct laser absorption by the substrates themselves. The film thickness is optimized to balance absorption efficiency with ease of formation.
Solution Approach 2:
The patent changes the physical parameters of the interface layer by controlling the thickness of the laser absorbing film within a specific range (1 nm to 100 nm). By adjusting this parameter, the system achieves optimal balance between laser energy absorption and ease of manufacture. The film thickness is a critical parameter that determines both separation reliability and manufacturing complexity.
2Reliability
If the laser absorbing film thickness is increased to improve energy absorption, then separation reliability improves, but the processing time increases and productivity decreases
Solution Approach 1:
The patent optimizes the laser absorbing film thickness parameter to a specific range (1 nm to 100 nm) that maximizes laser energy absorption efficiency. This parameter optimization ensures that sufficient energy is absorbed in a single laser pulse, enabling rapid separation without requiring multiple pulses or extended processing time, thus maintaining high productivity.
Solution Approach 2:
The patent employs pulsed laser irradiation instead of continuous laser exposure. The periodic nature of pulsed laser delivery allows the laser absorbing film to absorb energy in discrete intervals, achieving complete separation in a single pulse or minimal pulses. This periodic action prevents heat diffusion to surrounding areas and maintains processing speed.
3Device complexity
If the laser absorbing film is made thinner for easier manufacturing, then device complexity is reduced, but the separation precision and control are compromised
Solution Approach 1:
The patent establishes a specific thickness parameter range (1 nm to 100 nm) for the laser absorbing film that optimizes both manufacturing simplicity and separation precision. Within this range, the film is thin enough to be easily formed through conventional semiconductor fabrication processes while being thick enough to reliably absorb laser energy and achieve precise separation at the substrate interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable separation of the first substrate from the second substrate, maintaining consistent pulse energy and improving processing efficiency regardless of the laser absorbing film's thickness, thus overcoming the limitations of previous systems.
Implementation Method 1
an interface layer including a laser absorbing film and a separation facilitating film at least, and a second substrate are stacked on top of each other
Implementation Method 2
an interface laser radiating unit configured to radiate laser light to the laser absorbing film in a pulse shape
Data Source
AI summary
A substrate processing apparatus configured to process a combined substrate in which a first substrate and a second substrate are stacked on top of each other includes a substrate holder configured to hold the combined substrate; a laser radiating unit configured to radiate laser light to a laser absorbing film in a pulse shape; a moving mechanism configured to move the substrate holder and the laser radiating unit relative to each other; and a controller configured to control the laser radiating unit and the moving mechanism. The controller performs, based on a thickness of the laser absorbing film, a control of selecting a position of a separation surface between the first substrate and the second substrate from one of a position between the first substrate and the laser absorbing film or a position between the a separation facilitating film and the second substrate.