Laser Assembly Flip-Chip Packaging for Silicon Photonic Alignment
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Solution Overview
Problem
Current laser packaging schemes for photonic interconnects in high-performance computing systems are expensive due to costly components like collimators, mirrors, and AR coated facets, and require precise alignment, which is inefficient and time-consuming, especially when aligning multiple lasers simultaneously.
Innovation Solution
A packaging scheme that aligns multiple lasers simultaneously without separate manufacturing hardware, omitting collimators, mirrors, and AR coated facets, using a silicon photonic apparatus with precise alignment through a flip-chip process and capillary forces of solder bumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional laser packaging schemes are used with collimators, mirrors, and AR coated facets, then optical performance is maintained, but manufacturing cost increases significantly and assembly time increases
Solution Approach 1:
The patent removes collimators, mirrors, and AR coated facets from the laser packaging scheme, retaining only the essential laser diode and fiber coupling components. This extraction of non-essential components directly reduces manufacturing cost and assembly complexity while maintaining the core optical function of laser light generation and transmission.
Solution Approach 2:
The patent employs direct laser writing of waveguides in polymer materials as a low-cost alternative to traditional precision optical components. This additive manufacturing approach uses inexpensive materials and equipment compared to precision-machined collimators and mirrors, significantly reducing the cost per laser assembly.
2Manufacturing precision
If precise alignment of multiple lasers is performed sequentially with separate manufacturing hardware, then alignment precision is achieved, but manufacturing time increases significantly
Solution Approach 1:
The patent combines multiple laser alignment operations into a single parallel process using one robotic arm equipped with multiple digital cameras. Each camera captures images of fiducial marks on different lasers simultaneously, enabling parallel alignment of multiple lasers without requiring separate hardware for each laser, thus maintaining precision while dramatically increasing throughput.
Solution Approach 2:
The patent uses digital images of fiducial marks as copies of the physical laser positions to determine alignment. By capturing images of fiducial marks on multiple lasers simultaneously and processing these image copies, the system achieves precise alignment without physically manipulating each laser individually, enabling parallel processing and higher productivity.
3Measurement precision
If visual alignment techniques with digital cameras and fiducial marks are implemented, then alignment precision improves, but additional hardware cost and processing time are required
Solution Approach 1:
The patent makes a single robotic arm with digital cameras perform multiple alignment functions simultaneously. The same hardware setup used for capturing images of fiducial marks also serves as the alignment and positioning system, eliminating the need for separate specialized alignment equipment for each laser and reducing overall hardware complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces manufacturing time and cost per laser, achieving high precision alignment and functional silicon photonic interconnects without additional hardware, thereby reducing overall system costs.
Implementation Method 1
precise alignment through a flip-chip process and capillary forces of solder bumps
Data Source
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AI summary
Processes and apparatuses described herein reduce the manufacturing time, the cost of parts, and the cost of assembly per laser for photonic interconnects incorporated into computing systems. An output side of a laser assembly is placed against an input side of a silicon interposer (SiP) such that each pad in a plurality of pads positioned on the output side of the laser assembly is in contact with a respective solder bump that is also in contact with a corresponding pad positioned on the input side of the SiP. The laser assembly is configured to emit laser light from the output side into an input grating of the SiP. The solder bumps are heated to a liquid phase. Capillary forces of the solder bumps realign the laser assembly and the SiP while the solder bumps are in the liquid phase. The solder bumps are then allowed to cool.