Laser Machining Focus Path for Stable Crack Formation

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Solution Overview

Problem

Laser processing devices face challenges in achieving both high processing speed and stable crack formation to maintain quality, as multiple converging points can lead to unstable crack lengths and deteriorated cut surfaces due to crack connections.

Innovation Solution

A laser processing device and method that involves setting intersecting lines on the object, moving converging points to prevent crack connections, and strategically forming cracks to stabilize the crack length, thereby improving processing speed and quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple converging points are formed simultaneously in the thickness direction to improve processing speed, then processing speed is improved, but crack amount becomes unstable and processing quality deteriorates

Engineering Contradiction:
Improveprocessing speedVSAvoidprocessing quality
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent segments the laser processing into multiple passes: a first pass forms modified regions along a first line, and a second pass forms modified regions along a second line that intersects the first line. This segmentation prevents crack connection between multiple converging points while maintaining processing speed, as the intersecting line configuration ensures cracks do not connect between converging points formed in different passes.

Inventive Principle:
Principle #1Segmentation

2Productivity

If laser light is irradiated to straddle an already formed modified region to improve processing speed, then processing speed is improved, but crack amount destabilizes and cut surface quality deteriorates

Engineering Contradiction:
Improveprocessing speedVSAvoidcrack amount stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent introduces a second line that intersects the first line at an angle, transitioning from one-dimensional linear processing to two-dimensional angular processing. This dimensional change allows the laser to process across already-formed modified regions while the specific angular configuration prevents crack connection, maintaining both speed and reliability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Area of stationary object

If the second line intersects and extends beyond the first line, then processing coverage is improved, but crack connection between converging points may occur

Engineering Contradiction:
Improveprocessing coverageVSAvoidcrack connection
Core Design Contradiction:
Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent applies different processing strategies to different regions: the first line processes one set of modified regions, while the second intersecting line processes another set. The local quality of each line's processing path is optimized to prevent crack connection in its specific region, while the overall coverage is expanded through the intersection.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The approach enhances processing speed while suppressing crack destabilization, resulting in improved processing quality by controlling the formation and movement of converging points to prevent crack connections and stabilize crack lengths.

Implementation Method 1

a laser processing device for forming a modified region by irradiating an object with laser light

Methodology Applied
Scientific EffectLaser: Laser

Implementation Method 2

forming a first converging point of the laser light and a second converging point of the laser light located closer to an incident surface side

Methodology Applied
Scientific EffectLight concentration: Focusing

Data Source

PatentUS20230150067A1Laser machining device and laser machining method
Publication Date: 2023.05.18 HAMAMATSU PHOTONICS KK
  • US20230150067A1 patent drawing
  • US20230150067A1 patent drawing
  • US20230150067A1 patent drawing

AI summary

Provided is a laser processing device for forming a modified region by irradiating an object with laser light. The device includes a support portion configured to support the object, a laser irradiation unit configured to irradiate the object supported by the support portion with the laser light, a moving mechanism that moves at least one of the support portion and the laser irradiation unit such that a converging point of the laser light relatively moves with respect to the object, and a control unit that controls the laser irradiation unit and the moving mechanism. A first line extending along a first direction and a second line extending along a second direction intersecting the first direction and extending beyond the first line when viewed from a direction intersecting an incident surface of the laser light are set in the object.