Single-Lens Laser Machining for Adjustable Focus Depth
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Solution Overview
Problem
Current laser beam machining devices face limitations in flexibility and complexity, leading to increased costs and susceptibility to failures, particularly due to restrictive depth of focus and inability to adapt to varying workpiece thicknesses without altering beam quality or replacing process fibers.
Innovation Solution
A laser beam machining device with a single lens that allows variation in distance between the lens and the light exit point and machining point, enabling adjustable focus and depth of focus through axial displacement, allowing for continuous adaptation of beam geometry to workpiece dimensions without compromising beam quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single lens with variable distances is used, then device complexity is reduced and costs are lowered, but the ability to maintain focus quality across varying workpiece thicknesses becomes challenging
Solution Approach 1:
The patent implements dynamic adjustability by allowing the lens to be positioned at different distances from the light exit point and machining point. This dynamic configuration enables the system to adapt to varying workpiece thicknesses while maintaining optimal focus quality, resolving the contradiction between simplified structure and precision maintenance.
2Device complexity
If fixed focus parameters are used, then device structure is simplified, but adaptability to different workpiece thicknesses is reduced
Solution Approach 1:
The system transitions from fixed to dynamic focus parameters by enabling variable distances between the lens and both the light exit point and machining point. This dynamic capability allows adaptation to different workpiece thicknesses without complicating the overall device structure, as the adjustment mechanism is integrated into the existing optical path.
Solution Approach 2:
The patent changes the optical parameters (distances) rather than the physical structure of the components. By adjusting the positional parameters of the lens relative to other elements, the system achieves versatility across different workpiece thicknesses while maintaining a simple device structure with no additional mechanical complexity.
3Manufacturing precision
If multiple lenses or complex optical systems are used, then beam quality can be maintained, but device complexity and costs increase
Solution Approach 1:
Instead of adding more lenses to maintain beam quality, the patent achieves the same effect by changing the positional parameters of a single lens. By varying the distance between the lens and the light exit point/machining point, the system optimizes beam quality for different workpiece thicknesses without increasing device complexity or requiring multiple optical components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the device structure, reduces costs, and enhances flexibility by matching laser power to workpiece thickness, achieving high-quality cuts with improved power density and feed rates across different workpiece thicknesses.
Implementation Method 1
a single lens after the light exit point in the direction of radiation, which focuses the laser light and is designed to guide the focused laser light onto a machining point of a workpiece
Data Source
AI summary
A laser beam machining device (1) is provided, in which unfocused light (A) from a light exit point (B) is radiated onto a single lens (8), where in the lens (8) focuses the laser light (A) and guides it onto a machining point of a work piece (7). A distance (ma, mb) between the lens (8) and the light exit point (B) and a distance (la, lb) between the lens (8) and the machining point of the workpiece (7) and a distance between the light exit point (B) and the aforementioned machining point can be varied. Moreover, a process of usage of a laser beam machining device (1) is provided.