Laser Machining Focus Calibration for Weakened Region Cutting
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Solution Overview
Problem
Existing methods for forming weakened regions in metal films for precise cutting of devices with miniaturized wirings and stacked patterns are inefficient in acquiring suitable processing conditions.
Innovation Solution
A processing condition acquisition method and device that involves performing laser processing multiple times at different positions on a substrate's surface while varying the converging position of the laser light in the Z direction. This method includes capturing interface images using transmissive light and identifying the range of converging positions where damage occurs, which is critical for forming a weakened region suitable for precise cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser processing is performed to form a weakened region in a metal film for precise cutting, then cutting accuracy is improved, but the complexity of acquiring suitable processing conditions increases
Solution Approach 1:
The patent implements a feedback mechanism where interface images are captured after laser processing and analyzed to detect damage patterns. The converging position range is determined based on this feedback from the interface images, creating a closed-loop system that automatically identifies optimal processing conditions without requiring complex manual experimentation
Solution Approach 2:
The system performs self-characterization by automatically determining the appropriate converging position range through image analysis of laser-induced damage. The processing conditions are acquired through the system's own operations rather than external calibration, enabling autonomous optimization of cutting parameters
2Manufacturing precision
If the converging position of laser light is adjusted to form a weakened region, then cutting quality is improved, but the time required to acquire processing conditions increases
Solution Approach 1:
The patent performs preliminary laser processing at multiple different converging positions before actual cutting to characterize the damage pattern in advance. This preliminary action creates a database of interface images that reveals the optimal converging position range, enabling rapid selection of processing conditions without time-consuming adjustments during production
Solution Approach 2:
The system performs laser processing a plurality of times at different positions to acquire sufficient data for determining the converging position range. This excessive action of testing multiple positions ensures comprehensive characterization of the damage pattern, from which the optimal range can be reliably extracted
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively acquires processing conditions for forming weakened regions that allow for accurate cutting of devices with minimal external force, even in complex stacked patterns, by determining the optimal range of converging positions for the laser light.
Implementation Method 1
irradiating an object with laser light from a first surface side... forming a weakened region in a functional element layer
Implementation Method 2
capturing an image of the interface between the substrate and the functional element layer from the first surface side using transmissive light transmitting through the substrate
Data Source
AI summary
There is provided a processing condition acquisition method for acquiring conditions of laser processing for forming a weakened region in a functional element layer by irradiating an object with laser light from a first surface side, the object including a substrate including a first surface and a second surface opposite to the first surface, and the functional element layer provided on the second surface of the substrate, the method including: a first step of performing first processing as the laser processing a plurality of times at different positions in the first surface while changing a converging position of the laser light in a Z direction intersecting the first surface within a range including an interface between the substrate and the functional element layer.