Laser Folding of Planar Metal Sheets Into Complex 3D Structures

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Solution Overview

Problem

Current self-folding technologies face limitations when working with materials like metals, often requiring pre-patterning, specialized equipment, and manual handling, and struggle to create complex multifold structures without manual flipping or rotation.

Innovation Solution

The method employs laser forming to cut and fold unpatterned metal sheets using temperature gradient and buckling mechanisms, allowing for complex 3D shape creation without manual handling, using a low-cost, low-power laser to execute cuts and folds while the substrate remains immobile, and demonstrates the ability to mark surfaces originally on the underside without flipping.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional self-folding methods are used with metal materials, then folding capability is achieved, but pre-patterning and specialized equipment are required

Engineering Contradiction:
Improvefolding capabilityVSAvoidequipment requirements
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent replaces mechanical pre-patterning and specialized folding equipment with a laser-based thermal field system. The laser directly induces thermal stresses in unpatterned metal sheets to create controlled bending moments, eliminating the need for mechanical pre-processing and specialized folding apparatus.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical state and thermal parameters of the metal material through localized laser heating. By controlling temperature gradients and thermal stress parameters, the metal sheet undergoes controlled deformation and folding without requiring pre-patterning or specialized equipment.

Inventive Principle:
Principle #35Parameter changes

2Extent of automation

If complex multifold structures are created without manual handling, then automation is improved, but positioning control becomes more difficult

Engineering Contradiction:
Improvemanual handling requirementVSAvoidpositioning control
Core Design Contradiction:
Extent of automationVSManufacturing precision

Solution Approach 1:

The patent implements a self-positioning mechanism where the laser beam automatically tracks and follows the contour of the metal sheet during folding. The system uses the sheet's own geometry and the laser's tracking capability to maintain precise positioning without external motors or manual intervention, achieving both automation and precision.

Inventive Principle:
Principle #25Self-service

3Productivity

If surfaces on the underside are marked without flipping, then operation efficiency is improved, but marking precision becomes more difficult

Engineering Contradiction:
Improveoperation efficiencyVSAvoidmarking precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent transitions from 2D planar marking to 3D spatial marking by introducing an optical reflector. The laser beam reflects off the reflector at angled trajectories to access and mark surfaces that would normally require flipping, maintaining precision through controlled optical path geometry while improving operational efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the creation of complex multifold structures with high precision and flexibility, achieving angles exceeding 90° and complete 180° folds, and allows for precise alignment and interaction between components, enhancing small-scale metal fabrication capabilities.

Implementation Method 1

a laser generates localized heating and cooling, introducing thermal stresses for a controlled bending moment or other deformation

Methodology Applied
Scientific EffectLaser heating: Laser

Implementation Method 2

laser generates localized heating and cooling, introducing thermal stresses for a controlled bending moment or other deformation

Methodology Applied
Scientific EffectThermal stress: Thermal Expansion

Implementation Method 3

The laser creates a temperature gradient across the thickness of the substrate, inducing bending through differential thermal expansion

Methodology Applied
Scientific EffectTemperature gradient mechanism: Temperature Gradient

Implementation Method 4

buckling: The laser is scanned more slowly so heat propagates through the thickness of the sheet resulting in a lateral temperature gradient. The heated region attempts to expand laterally but is again constrained, resulting in a buildup of compressive stresses. Once these stresses reach a threshold, an instability develops and the heated area buckles

Methodology Applied
Scientific EffectBuckling:

Data Source

PatentUS11364566B2Complex laser folding and fabrication
Publication Date: 2022.06.21 UNITED STATES OF AMERICA THE AS REPRESENTED BY THE SEC OF THE ARMY
  • US11364566B2 patent drawing
  • US11364566B2 patent drawing
  • US11364566B2 patent drawing

AI summary

Provided, among other things, is a method of cutting and folding a planar substrate with a focused laser beam, directed from above the substrate, to form a shape with features in 3-dimensions, the method comprising: (a) executing from above laser cuts to the planar substrate so as to provide one or more a releasable segments; (b) executing from above one or more laser-executed upward folds to bend all or a portion of a releasable segment; and (c) executing from above one or more laser-executed downward folds to bend all or a portion of a releasable segment; wherein the cuts and folds are structured so that precursors to the 3D shape remain attached to the substrate while sufficient cuts and folds are made to form the 3D shape, and wherein the planar substrate is immobile during said steps (a) through (c), or is only moved in the plane of the substrate.