Laser Frit Bonding for Display Substrate Spacing Control
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Solution Overview
Problem
Existing methods for manufacturing display apparatuses often result in substrate deformation and inconsistent spacing between substrates, leading to optical interference and reduced visibility due to incomplete melting of frits during bonding.
Innovation Solution
A method involving the formation of a display unit on a first substrate, application of frit on an encapsulating substrate, followed by a heat treatment process including sintering and complete melting of the frit using a laser beam to ensure accurate bonding and prevent substrate deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If frit is not completely melted during bonding, then bonding process is simpler and faster, but substrate deformation occurs and spacing becomes inconsistent
Solution Approach 1:
The frit is pre-applied on the encapsulating substrate before the bonding process, and a preliminary melting step is performed to prepare the frit for optimal bonding. This preliminary action ensures that the frit is in the correct state before final bonding, preventing substrate deformation while maintaining consistent spacing.
Solution Approach 2:
The patent applies laser irradiation to locally and controllably melt the frit, changing its physical state from solid to liquid precisely where needed. This parameter change (temperature control via laser) allows the frit to flow and fill gaps uniformly, ensuring consistent substrate spacing without requiring complete melting of all frit, thus resolving the contradiction between bonding speed and spacing precision.
2Strength
If heat treatment is applied to melt frit, then substrate bonding strength increases, but substrate deformation occurs due to thermal stress
Solution Approach 1:
The patent replaces conventional uniform heat treatment with laser beam irradiation. The laser provides localized, controlled heating that melts only the frit material without excessively heating the substrates. This substitution of heating method achieves strong bonding through selective frit melting while minimizing thermal stress-induced substrate deformation.
Solution Approach 2:
Instead of applying heat uniformly across the entire substrate area, the patent uses laser irradiation to apply heat locally only to the frit regions requiring melting. This local quality approach ensures that bonding strength is enhanced where needed (at the frit locations) while the rest of the substrate remains at stable temperature, preventing shape distortion.
3Use of energy by moving object
If frit is not fully melted, then energy consumption is reduced, but optical interference occurs due to inconsistent spacing
Solution Approach 1:
The frit acts as an intermediary material between the substrates. By selectively melting the frit with laser irradiation, it flows to create uniform spacing and eliminate gaps that cause optical interference. This intermediary approach achieves consistent spacing (preventing optical interference) without requiring excessive energy, as only the frit material needs to be melted, not the entire substrate assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures accurate bonding of substrates, maintains consistent spacing, prevents optical interference, and enhances the adhesion strength and visibility of the display apparatus.
Implementation Method 1
completely melting the frit between the first substrate and the encapsulating substrate
Implementation Method 2
Melting at least a portion of the frit on the encapsulating substrate may include a heat treatment process
Implementation Method 3
sintering the fit on the encapsulating substrate, before melting at least a portion of the frit on the encapsulating substrate
Data Source
AI summary
Provided is a method of manufacturing a display apparatus, including forming a display unit on a first substrate; applying a fit on an encapsulating substrate; melting at least a portion of the frit on the encapsulating substrate; arranging and bonding the first substrate and the encapsulating substrate after melting at least a portion of the frit on the encapsulating substrate, so that the frit is disposed between the first substrate and the encapsulating substrate; and completely melting the frit between the first substrate and the encapsulating substrate.