Laser and Gas Chip Removal for Miniaturized LED Substrates
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Solution Overview
Problem
Miniaturized LED chips on circuit substrates are difficult to remove due to the size limitations of conventional tools, leading to inconvenience in replacement and potential damage to surrounding components.
Innovation Solution
A chip removing device and method utilizing a carrier substrate, a laser generation module to reduce bonding forces between chips and the substrate, and a blowing module to gently dislodge the chips using gas, allowing for precise removal without damaging adjacent components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional tools such as nozzles, knives or jigs are used to remove damaged LED chips, then the removal process is straightforward for larger chips, but the tools become too large to effectively remove miniaturized LED chips
Solution Approach 1:
The patent replaces conventional mechanical removal tools (nozzles, knives, jigs) with a laser-based system. The laser generation module emits laser beams to locally heat and weaken the bonding between the chip and substrate, enabling removal of miniaturized chips without requiring physical contact tools that would be too large for small chips.
Solution Approach 2:
The patent changes the bonding strength parameter by using laser heating to locally increase temperature at the chip-substrate interface. This thermal energy reduces the bonding force between the chip and substrate, allowing the chip to be gently separated. The blowing module then uses gas flow to complete the separation without mechanical contact.
2Productivity
If conventional mechanical tools are used to remove chips, then removal can be achieved, but surrounding components may be damaged due to the invasive nature of the tools
Solution Approach 1:
The patent applies laser energy locally only to the specific chip-substrate bonding area that needs to be removed. The laser beam is focused on the target chip's bonding region, heating only that localized area to weaken the bond. This localized heating approach does not affect surrounding components, allowing efficient removal without causing damage to adjacent chips or substrate structures.
3Volume of moving object
If miniaturized LED chips are used to reduce device size, then electronic devices become smaller, but the chips become difficult to remove when damaged due to their small size
Solution Approach 1:
The patent replaces mechanical removal tools with a laser-based system that does not require physical contact with the chip. The laser generation module can precisely target and heat the bonding area of miniaturized chips without being constrained by tool size. The blowing module uses gas flow to gently separate the heated chip from the substrate, enabling removal of chips that are too small for conventional mechanical tools.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the convenience of chip removal, prevents solder residue on the substrate, and maintains soldering accuracy, effectively addressing the challenges posed by miniaturized components and conventional tool limitations.
Implementation Method 1
The laser generation module corresponds to the carrier substrate for applying a laser beam to the chip to reduce the bonding force between the chip and the substrate
Implementation Method 2
The blowing module is disposed above the carrier substrate and close to the substrate for applying a gas to the chip to blow the chip away from the substrate
Data Source
AI summary
A chip removing device and a chip removing method are provided. The chip removing device includes: a carrier substrate, a laser generation module, and a blowing module. The carrier substrate carries at least one substrate, and a plurality of chips disposed on the substrate. The laser generation module corresponds to the carrier substrate and is used to apply a laser beam to the chip to reduce the bonding force between the chip and the substrate. The blowing module is disposed above the carrier substrate and close to the substrate for applying a gas to the chip to blow the chip away from the substrate.