Laser Processing Gas Flow Reversal for Debris-Free Precision
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Solution Overview
Problem
Current semiconductor exposure technologies face challenges in achieving high resolution due to chromatic aberrations caused by wide spectral linewidths of KrF and ArF excimer laser apparatuses, which affect the processing of miniaturized semiconductor integrated circuits, and difficulties in processing materials like glass and ceramics with visible or infrared laser light.
Innovation Solution
A laser processing system that includes a placement base, an optical system, a gas supply and recovery system, and a controller to manage the direction of gas flow in response to the movement of the irradiated region, ensuring the gas flows opposite to the direction of beam movement, thereby improving processing precision and material handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If KrF or ArF excimer laser apparatuses are used for exposure, then ultraviolet light with short wavelength (248 nm or 193 nm) can be obtained, but chromatic aberrations occur due to wide spectral linewidth (350-400 pm), resulting in decreased resolution
Solution Approach 1:
The patent applies line narrowing technology to change the spectral width parameter of the laser light from 350-400 pm to a narrower range, thereby reducing chromatic aberrations and improving resolution while maintaining the short wavelength advantage for high-resolution exposure
2Adaptability or versatility
If visible or infrared laser light is used to process materials, then processing can be performed with common laser sources, but glass and ceramic materials cannot be processed effectively due to insufficient absorption
Solution Approach 1:
The patent utilizes the specific parameter of excimer laser light (ultraviolet wavelength with high photon energy) that matches the absorption characteristics of glass and ceramic materials, enabling effective processing of these materials which cannot be processed with visible or infrared laser light
3Productivity
If the irradiated region is moved during laser processing, then processing coverage is improved, but debris generated during processing may reattach to processed surfaces, reducing quality
Solution Approach 1:
The patent reverses the conventional approach by introducing gas flow that moves in the opposite direction to the irradiated region movement, creating a protective gas barrier that prevents debris from reattaching to processed surfaces while maintaining processing coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances processing resolution and uniformity by effectively removing debris and preventing reattachment, improving the processing rate and quality of semiconductor wafers and other materials.
Implementation Method 1
a gas supply port via which a gas is supplied to a periphery of an irradiated region of the processing receiving object that is a region irradiated with the laser light, a gas recovery port via which the gas supplied via the gas supply port is recovered
Implementation Method 2
The excimer laser light having photon energy higher than the binding energy of a polymer material can unbind the molecules that form the polymer material
Implementation Method 3
an optical system configured to guide laser light to the processing receiving object placed on the placement base
Data Source
AI summary
A laser processing apparatus according to the present disclosure includes a placement base on which a processing receiving object is placed, an optical system that guides laser light to the processing receiving object, a gas supply port via which a gas is supplied to a laser light irradiated region of the processing receiving object, a gas recovery port via which the supplied gas is recovered, a mover that moves the irradiated region, and a controller that controls, in accordance with the moving direction of the irradiated region, the direction of the flow of the gas flowing from the gas supply port to the gas recovery port, and the controller changes the direction of the gas flow in response to a change in the moving direction of the irradiated region in such a way that the gas flows in the direction opposite the moving direction of the irradiated region.