Laser Chamfered Corner Cutting for Glass Edge Quality
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Solution Overview
Problem
The existing methods for polishing glass edges to achieve smooth or round edges in full or half full screens are time-consuming, increase production costs due to glass breakage, and require additional jigs, leading to increased weight and thickness, which is inefficient for producing versatile electronic products with chamfered corners.
Innovation Solution
A cutting method that uses a laser beam to modify glass substrates by selecting a light pattern-adjusting module based on pre-cut chamfer angles, adjusting the axial energy distribution and focal position of the laser beam to create chamfered surfaces without the need for additional jigs, allowing for various chamfer angles and reducing the risk of glass damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional polishing method is used to obtain smooth or round edges, then edge quality is improved, but production time increases and yield decreases
Solution Approach 1:
The patent replaces the traditional mechanical polishing system with a laser-based modification system. The laser beam modifies the glass substrate by creating a modified region that extends in the thickness direction, which is then etched to form chamfered surfaces. This substitution of mechanical polishing with laser modification and etching eliminates the need for contact-based polishing processes, thereby reducing production time and minimizing glass breakage while maintaining edge quality.
Solution Approach 2:
The patent utilizes parameter changes in the laser beam, specifically adjusting the axial energy distribution and focal position, to control the appearance and depth of the modified region. By varying these parameters, the system can create modified regions with different appearances and depths, which after etching produce various chamfer angles. This parameter control enables precise edge quality achievement without the time-consuming mechanical polishing process.
2Stability of the object's composition
If additional jigs are used to fix the glass during polishing, then positioning stability is improved, but device complexity and weight increase
Solution Approach 1:
The patent replaces the mechanical jig-based positioning system with a laser-based modification system. The laser beam can be precisely directed and focused on the glass substrate without requiring physical contact or mechanical fixtures. The focal position adjustment capability of the laser system provides inherent positioning stability, eliminating the need for additional jigs and support structures that would increase device complexity and weight.
3Strength
If glass thickness and width are increased for polishing yield, then structural strength is improved, but product weight and thickness increase
Solution Approach 1:
The patent replaces mechanical polishing with laser modification and etching, which can process the glass substrate without requiring increased thickness or width for yield improvement. The laser beam modifies the glass along its propagation path, creating a controlled modified region that can be etched to form chamfered surfaces. This process maintains the original glass dimensions, thereby reducing product weight and thickness while achieving the desired edge quality and structural strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces labor time, minimizes glass damage, and produces lightweight, thin substrates with desired chamfered surfaces, meeting the requirements for versatile electronic products while eliminating the need for additional support and increasing the yield.
Implementation Method 1
the light pattern-adjusting module emitting a laser beam to a substrate and thus forming a modified region extending in a thickness direction at the substrate
Implementation Method 2
adjusting an axial energy distribution of a light pattern of the laser beam
Implementation Method 3
an etching process can be applied to break the substrate so as to obtain chamfered corner surfaces
Data Source
AI summary
A cutting method for forming a chamfered corner includes a step of selecting a light pattern-adjusting module according to a pre-cut chamfer angle, a step of the light pattern-adjusting module emitting a laser beam to a substrate and thus forming a modified region extending in a thickness direction at the substrate, a step of the light pattern-adjusting module adjusting an axial energy distribution of a light pattern of the laser beam to vary an appearance of the modified region so as to form the modified region fulfilling the pre-cut chamfer angle, and a step of etching the substrate having the modified region to form a chamfered surface on the substrate by cutting the modified region from the substrate.