Laser Glass Substrate Division to Suppress SeWaRe Cracks
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Solution Overview
Problem
Existing methods for dividing glass substrates, such as mechanical processing, often result in SeWaRe defects due to cracks forming during the division process, which can negatively impact the manufacturing yield and reliability of semiconductor elements.
Innovation Solution
A method involving multiple laser processes, including stack removal, laser perforation, and physical or laser breaking, with specific wavelength and pulse width parameters, to minimize surface etching and crack formation, followed by chamfering to improve defect suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical processing is used to divide the glass substrate, then the division process can be performed, but cracks occur on the glass core surface or inside, causing SeWaRe defects
Solution Approach 1:
The patent replaces mechanical processing methods (wheel or blade) with laser-based processing methods. The laser ablation process removes material through vaporization and ejection without mechanical contact, eliminating the crack formation that occurs with mechanical tools. This substitution maintains division efficiency while preserving glass core integrity.
Solution Approach 2:
The patent utilizes laser parameters (wavelength, pulse duration, power) to control the material removal process. By adjusting these parameters, the laser can precisely ablate material along the division line without generating mechanical stresses that cause cracks. The laser parameters are optimized to achieve clean separation while maintaining structural integrity.
2Loss of substance
If laser processing is used with deep etching, then material removal is effective, but excessive etching damages the glass core and causes defects
Solution Approach 1:
The patent applies laser processing with localized precision, concentrating energy only where material removal is needed (the stack layers) while preserving the underlying glass core. The laser parameters are controlled to achieve sufficient etching depth for stack removal without exceeding the threshold that would damage the glass core structure.
Solution Approach 2:
The patent performs preliminary laser etching to remove stack material before final division. This preliminary action prepares the surface by removing unwanted layers while controlling etch depth to prevent glass core damage, creating optimal conditions for subsequent division steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively suppresses SeWaRe defects by minimizing crack formation and enhancing the efficiency of the division process, while maintaining the integrity of semiconductor elements, and is applicable to glass substrates of varying thicknesses.
Implementation Method 1
a stack removal operation of removing an upper stack and a lower stack of a division target region along a predetermined line by using a laser
Implementation Method 2
a laser perforation operation of perforating the glass core along the predetermined line by using the laser
Data Source
AI summary
A method of dividing, into a plurality of units, a glass substrate including a glass core, an upper stack stacked on a top surface of the glass core, and a lower stack stacked on a bottom surface of the glass core, includes a stack removal operation of removing an upper stack and a lower stack of a division target region along a predetermined line by using a laser, a laser perforation operation of perforating the glass core along the predetermined line by using the laser, and a physical or laser breaking operation of dividing the glass substrate on which the perforation operation is performed, into the plurality of units by using a physical or laser method.