Laser Separation of Glass-Resin Laminates Without Substrate Damage
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Solution Overview
Problem
Current methods for cutting and separating layered stacks of glass substrates and resin are inefficient, lacking in speed, accuracy, and reliability, and often result in damage to the glass substrates during the process.
Innovation Solution
A method involving laser processing using a pulsed laser beam to create a contour line of defects in the glass substrates, allowing for precise separation of the laminate workpiece stack, including the use of an infrared laser to induce thermal stress and facilitate separation, while avoiding damage by separating the resin layer first to provide a pathway for ablated material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional cutting methods are used to separate layered stacks, then separation can be achieved, but the process is slow and causes damage to glass substrates
Solution Approach 1:
The patent replaces conventional mechanical cutting methods with laser-based processing. A pulsed laser creates contour lines of defects in the glass substrates, and thermal stress induces crack propagation along desired separation lines, eliminating mechanical contact and associated damage while significantly increasing separation speed
Solution Approach 2:
The patent utilizes changes in material properties under laser irradiation. The laser parameters (pulse duration, energy density, wavelength) are optimized to induce specific effects: contour line formation through defect creation, and crack propagation through thermal stress. These parameter changes enable precise control over the separation process without damaging the glass substrates
2Manufacturing precision
If laser processing is applied to create contour lines and separate layers, then separation accuracy is improved, but process complexity increases
Solution Approach 1:
The patent divides the separation process into distinct sequential stages: first creating contour lines of defects in the glass substrates, then inducing crack propagation through thermal stress, and finally separating the resin layer. This segmentation allows each stage to be optimized independently, achieving high precision while managing overall process complexity through systematic breakdown of operations
3Object-affected harmful factors
If the resin layer is separated first to create pathways, then glass substrate damage is reduced, but additional processing steps are required
Solution Approach 1:
The patent performs preliminary laser processing to create contour lines of defects in the glass substrates before attempting crack propagation. These pre-created defect pathways guide subsequent crack development and reduce uncontrolled damage. The resin layer separation is then performed along these predetermined paths, minimizing glass damage while the integrated laser system manages processing steps efficiently
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables faster, cleaner, and more accurate separation of layered stacks with reduced risk of glass substrate damage, improving production efficiency and quality by using laser-induced defects and thermal stress to propagate cracks along desired separation lines.
Implementation Method 1
focusing the pulsed laser beam focal line into the transparent workpiece to generate an induced absorption within the transparent workpiece such that the induced absorption produces a defect within the transparent workpiece
Implementation Method 2
the pulsed laser beam focal line is directed into the transparent workpiece at a location along or near the contour line and translating the transparent workpiece and the pulsed laser beam focal line relative to each other along or near the contour line
Implementation Method 3
focusing the pulsed laser beam focal line into the resin layer and translating the laminate workpiece stack and the pulsed laser beam focal line relative to each other to ablate the resin layer material along the resin layer separation line
Data Source
Figure 1A~1B
Figure 1C
Figure 2
AI summary
A method of laser processing a laminate workpiece stack (110) includes forming a contour line in a first transparent workpiece (112a) of the laminate workpiece stack (110) having a resin layer (120) disposed between the first transparent workpiece (112a) and a second transparent workpiece (112b). Forming the contour line includes focusing a pulsed laser beam (152) into a pulsed laser beam focal line directed into the first transparent workpiece (112a) to generate an induced absorption within the first transparent workpiece (112a) and translating the pulsed laser beam focal line along a first workpiece separation line, thereby laser forming the contour line having a plurality of defects. The method also includes separating the resin layer (120) along a resin separation line by focusing the pulsed laser beam (152) into the pulsed laser beam focal line directed into the resin layer (120) and translating the pulsed laser beam focal line along the resin separation line, thereby laser ablating the resin layer (120).