Laser-Heated Gripper for Precise Test Contact Repositioning
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Solution Overview
Problem
Existing methods for producing test contact arrangements struggle to correct incorrectly positioned test contacts on a test contact carrier, leading to potential rejection during quality control due to deviations from admissible tolerances.
Innovation Solution
A method and device that utilize a gripping tool with a heat transfer surface and an absorption surface treated with laser radiation to measure and adjust the temperature of the solder material, allowing for precise movement of the gripping tool to correct the position of the test contact when it is incorrectly positioned, eliminating the need for a radiation channel and focusing laser radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a gripping tool is used to mechanically adjust the position of incorrectly positioned test contacts, then the position can be corrected, but mechanical loads are applied to the test contact and solder connection which may cause damage
Solution Approach 1:
The patent replaces direct mechanical adjustment with a hybrid approach: the gripping tool applies only gripping force to hold the test contact, while laser radiation provides the heating function previously achieved by mechanical pressure. This substitutes the mechanical heating mechanism with optical heating, eliminating the need for mechanical loads during position correction.
Solution Approach 2:
The patent introduces an intermediary heating mechanism (laser radiation absorbed by the gripping tool and transferred to the solder) between the gripping tool and the solder connection. This intermediary allows temperature control during position adjustment without requiring direct mechanical pressure on the solder joint, thus protecting the solder connection strength while enabling position correction.
2Measurement precision
If laser radiation is focused directly onto the solder material through a radiation channel in the gripping tool, then precise heating is achieved, but the device complexity increases due to the required radiation channel and focusing mechanisms
Solution Approach 1:
The patent extracts the radiation channel and focusing mechanisms from the gripping tool, eliminating these complex components. Instead, the gripping tool simply provides an absorption surface for laser radiation, and the heating is achieved through thermal conduction from the gripping tool to the solder material, simplifying the overall device structure while maintaining temperature control precision.
Solution Approach 2:
The gripping tool acts as an intermediary medium that absorbs laser radiation and transfers the heat to the solder connection through thermal conduction. This intermediary approach eliminates the need for direct laser focusing mechanisms, reducing device complexity while maintaining precise temperature control through the thermal properties of the gripping tool material.
3Manufacturing precision
If the gripping tool applies mechanical force to reposition the test contact, then position correction is achieved, but the solder connection may be damaged due to excessive mechanical loads
Solution Approach 1:
The patent substitutes mechanical heating and positioning forces with a combination of gentle mechanical gripping and optical heating. The gripping tool applies only sufficient force to hold and reposition the test contact body, while laser radiation provides the thermal energy needed to soften the solder, eliminating the need for excessive mechanical forces that would damage the solder connection.
Solution Approach 2:
The patent changes the physical state of the solder material by controlling temperature through laser heating, transitioning the solder from a hard state to a softened state that allows easy repositioning. This parameter change (temperature) enables position correction without requiring increased mechanical forces, thus avoiding damage to the solder connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables correction of test contact positions without mechanical loads, ensuring proper alignment and preventing rejection by indirectly heating the solder material, thus maintaining the quality of the test contact arrangement.
Implementation Method 1
an absorption surface which is realized on an outer surface of the gripping tool being treated with laser radiation
Implementation Method 2
at least one gripping surface which is realized as a heat transfer surface rests against a surface of the test contact conducting heat
Implementation Method 3
measuring the temperature reached in the solder material of the solder connection during the radiation treatment
Implementation Method 4
when the temperature is at the softening point of the solder material
Data Source
AI summary
A method for repairing a test contact arrangement in which a test contact which is disposed on a test contact carrier by means of solder material and is incorrectly positioned is gripped at a body edge by means of a gripping tool in a gripping contact phase, an absorption surface which is realized on an outer surface of the gripping tool is treated with laser radiation during the gripping contact phase, and the gripping tool performs a movement on at least one axis when the temperature is at the softening point of the solder material, in such a manner that the incorrect position is corrected by means of the movement to bring the test contact into a desired position.