Semiconductor Laser Dividing Groove Geometry for Precise Bar Separation
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Solution Overview
Problem
Existing methods for manufacturing semiconductor laser devices face challenges in accurately and efficiently dividing semiconductor laser bars into individual devices, leading to inefficiencies in time and accuracy.
Innovation Solution
A method involving the formation of device dividing grooves with inclined inner surfaces, where the first portion has a steeper inclination than the second portion, allowing for precise alignment and reduced risk of cracking, and the use of dry etching with chlorine-based gases for accurate control of the groove shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If vertical grooves with equal width are formed as device separation grooves, then the manufacturing process is simple, but the device division accuracy is insufficient and cracking risk increases
Solution Approach 1:
The patent applies asymmetry by forming device separation grooves with a V-shape cross-section where the groove width varies along its length. Specifically, the groove has a wider upper portion and a narrower lower portion, creating an asymmetric geometry that differs from conventional vertical grooves of equal width. This asymmetric shape allows the groove to accommodate thermal expansion and stress distribution more effectively, preventing cracking while maintaining manufacturing simplicity through a single etching process.
Solution Approach 2:
The patent employs parameter changes by varying the width parameter of the device separation groove along its length. The groove width transitions from a larger value at the upper surface to a smaller value at the lower portion, creating a tapered profile. This parameter variation optimizes both the ease of division (by providing sufficient width at the surface for clean separation) and the precision of division (by narrowing the groove at the base to prevent cracking and ensure accurate separation).
2Productivity
If the entire inner surface of the device dividing groove is inclined at a substantially constant inclination angle, then device division can be performed, but it is difficult to accurately align the central position of the bottom portion on the device dividing line
Solution Approach 1:
The patent applies asymmetry by creating a groove profile where the inclination angle varies along the length of the groove. The upper portion has a steeper inclination angle that facilitates rapid material removal and efficient division, while the lower portion has a gentler inclination angle that enables precise alignment and positioning. This asymmetric angular configuration allows the groove to serve dual functions: fast division in the upper region and accurate positioning in the lower region.
Solution Approach 2:
The patent segments the groove into distinct portions with different geometric characteristics. The groove is divided into an upper portion with steeper inclination and a lower portion with gentler inclination, each optimized for specific functions. This segmentation allows independent optimization of division speed (upper portion) and alignment accuracy (lower portion), resolving the contradiction between productivity and precision.
3Productivity
If device division is performed in a short time, then productivity improves, but the accuracy of device division may be compromised
Solution Approach 1:
The patent applies preliminary action by pre-forming the asymmetric V-shaped groove geometry through a single etching process before the actual device division step. The groove is prepared with optimized width and inclination parameters that facilitate both rapid and accurate division. This preliminary preparation eliminates the need for multiple adjustment steps during division, enabling high-speed operation without sacrificing precision.
Solution Approach 2:
The patent uses parameter changes in the groove geometry (width and inclination angle varying along the length) to enable both fast and accurate division. The varying width parameter provides sufficient material removal rate for productivity while the narrowing toward the base ensures precise alignment. This parameter optimization allows the division process to achieve both speed and accuracy simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables faster and more accurate division of semiconductor laser devices, enhancing mechanical strength and reducing the risk of damage during processing, while improving the yield and quality of the semiconductor laser devices.
Implementation Method 1
The device dividing groove has a first portion positioned on an opening side of the device dividing groove and a second portion positioned on a bottom portion side of the device dividing groove with respect to the first portion, wherein at least a portion of a first inner surface of the device dividing groove formed by the first portion in the second direction is inclined with the thickness direction
Implementation Method 2
the use of dry etching with chlorine-based gases for accurate control of the groove shape
Data Source
AI summary
A method for manufacturing a semiconductor laser device of an embodiment includes a first step of preparing a wafer and a second step of forming a device dividing groove by etching along a device dividing line. The device dividing groove has a first portion and a second portion. At least a portion of an inner surface of the device dividing groove formed by the first portion is inclined with a Z-axis direction such that a width of the device dividing groove in a Y-axis direction decreases from a first primary surface side toward a second primary surface side. An inclination angle of an inner surface of the first portion with respect to the Z-axis direction is larger than an inclination angle of an inner surface of the second portion with respect to the Z-axis direction.