Laser Grooving Die Attach Film for Accurate Chip Singulation
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Solution Overview
Problem
In the process of singulating element chips from a substrate mounted on a die attach film, the die attach film often peels off and floats away during the cool expansion system, leading to pickup errors as it is mistakenly recognized as a chip by the camera-based bonding device.
Innovation Solution
A method involving a laser grooving step where a laser beam is irradiated to both the protective film and the die attach film protruding from the substrate, creating a cut that allows the die attach film to split correctly, preventing it from floating away during the pickup process, and ensuring accurate chip recognition and separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the die attach film is made larger than the substrate for ease of positioning and versatility, then the ease of operation is improved, but the die attach film peels off and floats away during the cool expansion system, causing pickup errors
Solution Approach 1:
The patent applies laser grooving to the die attach film before the cool expansion process. This preliminary action creates predetermined separation lines that guide the film's behavior during expansion, preventing it from floating away uncontrollably and causing pickup errors, while still maintaining the larger size for ease of positioning
2Ease of operation
If the die attach film is expanded to widen the gap between element chips, then the ease of operation is improved, but the die attach film fails to follow the dicing tape and peels off at the peripheral portion
Solution Approach 1:
The patent uses laser grooving to segment the die attach film by creating cuts along the dicing region. This segmentation allows the film to be divided into sections that can expand independently during the cool expansion process, preventing the film from peeling off at peripheral portions while maintaining overall film integrity
3Ease of manufacture
If the substrate is diced first and then the die attach film is split by cool expansion system, then the manufacturing process is simplified, but the die attach film peels off and floats away causing pickup errors
Solution Approach 1:
The patent introduces laser grooving as a preliminary action performed on the die attach film before the cool expansion process. This additional step prevents the film from floating away during expansion, maintaining pickup accuracy while keeping the overall manufacturing process relatively simple
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the productivity of element chip production by ensuring accurate chip separation and reducing pickup errors, as the die attach film splits predictably along the cut, facilitating efficient handling and processing.
Implementation Method 1
a laser grooving step of irradiating a laser beam to the protective film along the dicing region, to form an opening in the protective film
Implementation Method 2
a first etching step of exposing the substrate to a first plasma to etch the substrate exposed from the opening
Data Source
AI summary
An element chip manufacturing method including: attaching a substrate via a die attach film (DAF) to a holding sheet; forming a protective film that covers the substrate; forming an opening in the protective film with a laser beam, to expose the substrate in the dicing region therefrom; exposing the substrate to a first plasma to etch the substrate exposed from the opening, so that a plurality of element chips are formed from the substrate and so that the DAF is exposed from the opening; exposing the substrate to a second plasma to etch the die attach film exposed from the opening, so that the DAF is split so as to correspond to the element chips; and detaching the element chips from the holding sheet, together with the split DAF. The DAF is larger than the substrate. The method includes irradiating the laser beam to the DAF protruding from the substrate.