Semiconductor Shielding Layer Separation Using Laser-Grooved Jig

The patent applies preliminary action by forming grooves in the adhesive layer and polyimide film before applying the shielding layer. These grooves are pre-formed to guide the shielding layer's separation, preventing burr formation during the debonding process. This preliminary structuring of the adhesive and film layers ensures that when the package is removed from the jig, the shielding layer breaks cleanly along the groove lines rather than forming metal burrs.

The patent applies the taking out principle by extracting the problematic portion of the shielding layer through the pre-formed grooves. The grooves act as separation channels that guide the shielding layer to break away cleanly from the jig along predetermined paths. This extraction mechanism prevents loose burrs from being left on the package, as the shielding layer is systematically removed through the groove structures rather than being forcibly debonded, which would create burrs.

The patent eliminates the need for additional burr removal processing steps by incorporating preliminary groove formation into the adhesive and polyimide film layers. These grooves are created during the packaging process itself, before the shielding layer is applied. The grooves serve a dual function: they provide structural guidance for shielding layer application and simultaneously act as pre-defined separation paths for clean debonding. This integrated approach achieves burr-free surfaces without requiring separate post-processing steps.