Laser-Grooved Jig for Burr-Free Semiconductor Shielding
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Solution Overview
Problem
Existing semiconductor manufacturing methods result in the formation of metal burrs during the creation of shielding layers, which require additional processing steps to remove and can cause malfunctions due to loose burrs sticking to components.
Innovation Solution
The use of laser grooving to form grooves in the jig's adhesive layer and polyimide film, ensuring the shielding layer aligns with the side surfaces of the package, allowing it to break cleanly and reducing the likelihood of burrs forming.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shielding layer is formed over the package using conventional methods, then electromagnetic shielding is provided, but metal burrs are formed during the process
Solution Approach 1:
The patent applies preliminary action by forming grooves in the adhesive layer and polyimide film before depositing the shielding layer. These pre-formed grooves guide the shielding layer to break cleanly at predetermined locations, preventing burr formation while maintaining shielding effectiveness.
Solution Approach 2:
The patent segments the shielding layer into discrete portions by forming grooves that create separation lines. This segmentation allows the shielding layer to break cleanly into defined sections rather than forming continuous burrs, resolving the contradiction between maintaining shielding coverage and preventing harmful metal burrs.
2Reliability
If additional processing steps are used to remove metal burrs, then component malfunction is prevented, but manufacturing complexity increases
Solution Approach 1:
The patent extracts the burr prevention function into the groove formation step itself. By incorporating the separation guidance into the adhesive layer and polyimide film structure before shielding deposition, the need for separate burr removal steps is eliminated, reducing manufacturing complexity while maintaining component reliability.
Solution Approach 2:
The preliminary formation of grooves in the adhesive and polyimide layers prevents burr formation during shielding layer deposition. This preliminary structuring eliminates the need for subsequent burr removal operations, simultaneously improving reliability and reducing process complexity.
3Ease of manufacture
If the shielding layer is formed without grooves, then the manufacturing process is simpler, but burrs form and stick to components
Solution Approach 1:
The patent introduces grooves in the adhesive layer and polyimide film as intermediary structures that mediate between the shielding layer and the package. These grooves act as separation guides that enable clean breaking of the shielding layer without requiring complex additional processing steps, thus maintaining ease of manufacture while preventing harmful burrs.
4Object-generated harmful factors
If laser grooving is used to form grooves in the adhesive layer and polyimide film, then burr formation is reduced, but additional processing time is required
Solution Approach 1:
The patent merges the groove formation step with the existing manufacturing process flow, integrating laser grooving of the adhesive layer and polyimide film into the preparation sequence before shielding layer deposition. This integration allows burr prevention to be achieved without requiring separate, time-consuming post-processing steps, thus reducing overall processing time while minimizing burr formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively minimizes burr formation, simplifies the manufacturing process, and reduces the risk of component malfunctions by ensuring a clean separation of the shielding layer from the jig, thus enhancing production efficiency and reliability.
Implementation Method 1
A laser is used to form a groove in the adhesive layer and polyimide film
Data Source
AI summary
A semiconductor device is formed using a jig. The jig includes a metal frame, a polymer film, and an adhesive layer disposed between the metal frame and polymer film. An opening is formed through the adhesive layer and polymer film. A groove is formed around the opening. A semiconductor package is disposed on the jig over the opening with a side surface of the semiconductor package adjacent to the groove. A shielding layer is formed over the semiconductor package and jig. The semiconductor package is removed from the jig.