Laser Machining Head Monitoring for Optical Abnormality Detection
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Solution Overview
Problem
Conventional laser machining systems fail to detect minor abnormalities in the laser optical system leading from the laser oscillator to the machining head, leading to potential damage and costly repairs, as they rely on light quantity measurements that are insensitive to subtle changes and optical axis alignment issues.
Innovation Solution
A laser machining system with a machining head equipped with a wavelength selective mirror and image capturing devices that monitor the incident light illuminance distribution and temperature, allowing for sensitive detection of abnormalities and control of the laser beam output to prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If light quantity measurement is used for abnormality detection, then the detection method is simple, but the detection precision is insufficient for minor abnormalities
Solution Approach 1:
The patent transitions from one-dimensional light quantity measurement to two-dimensional incident light illuminance distribution detection using image capturing devices. This dimensional expansion enables detection of subtle alignment issues and minor abnormalities that scalar light quantity measurements cannot detect, directly resolving the contradiction between detection precision and system complexity.
Solution Approach 2:
The patent replaces conventional light quantity measurement methods with image capturing devices that provide spatially-resolved illuminance distribution. This substitution transforms the detection mechanism from simple photodetection to spatial mapping, enabling precise detection of optical axis alignment issues and minor component abnormalities while maintaining system simplicity through digital image processing.
2Reliability
If reflected light detection is performed at the laser device body, then the detection position is convenient, but the damage prevention capability is insufficient
Solution Approach 1:
The patent positions image capturing devices at the machining head to detect abnormalities before they propagate and cause severe damage to the laser device body. By performing detection at the point of potential failure origin, the system enables preliminary intervention that prevents cascading damage, directly improving reliability while the automated detection maintains ease of operation.
Solution Approach 2:
The patent introduces image capturing devices as intermediaries between the optical components and the control system. These devices capture illuminance distribution patterns that serve as early warning signals for potential damage, enabling preventive action before actual damage occurs. The intermediary detection mechanism bridges the gap between optical system state and control system response.
3Measurement precision
If conventional light quantity monitoring is used, then the system structure is simple, but the ability to detect optical axis alignment issues is insufficient
Solution Approach 1:
The patent employs image capturing devices to obtain two-dimensional incident light illuminance distribution patterns, enabling detection of optical axis alignment issues through spatial analysis. The distribution patterns provide directional and positional information that scalar light quantity measurements cannot provide, achieving precise alignment detection while the image processing algorithms maintain system simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively detects minor abnormalities and prevents damage to the laser optical system and machining head by monitoring light quantity and temperature changes, enabling timely intervention and reducing the risk of extensive repairs.
Implementation Method 1
at least one wavelength selective mirror having wavelength selectivity with various values of reflectivity and transmittance according to wavelengths
Implementation Method 2
at least one image capturing device... detecting incident light illuminance distribution appearing on an image capturing surface of the image capturing device
Data Source
AI summary
The laser machining system includes a laser device configured to output a laser beam, and a machining head configured to emit the laser beam emitted by a laser oscillator of the laser device and propagated through an optical fiber, to a workpiece in order to perform laser machining. The machining head includes at least one wavelength selective mirror having wavelength selectivity with various values of reflectivity and transmittance according to wavelengths, and at least one image capturing device. The laser machining system monitors abnormality in a laser optical system leading from the laser oscillator to the machining head, during the laser machining, by reflecting light propagated from a side of introduction of the laser beam into the machining head by the wavelength selective mirror, making the light incident on an image capturing surface of the image capturing device, and detecting incident light illuminance distribution appearing on the image capturing surface of the image capturing device.