Adjustable Laser Machining Head for Aperture and Heat Control
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Solution Overview
Problem
Laser processing heads with small apertures in laser cutting systems suffer from power loss and increased heating, leading to reduced productivity and contamination issues due to absorbed and scattered laser radiation, especially in high-power applications.
Innovation Solution
A laser processing head with an adjustable aperture system that allows for varying the effective size of the through opening based on the processing mode, enabling optimal power utilization and minimizing heating by adjusting the distance of the aperture from the interface, thus allowing for different numerical apertures for flame and fusion cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a small aperture is used in the laser processing head, then peripheral radiation is reduced and cutting performance is improved, but laser power is reduced by 2-3% and heating of the processing head increases
Solution Approach 1:
The patent employs a deformable membrane instead of a fixed aperture, allowing the aperture size to be dynamically adjusted during operation. This enables the system to optimize the balance between cutting performance (requiring smaller aperture) and power transmission (requiring larger aperture) based on real-time processing conditions, thereby resolving the contradiction between these two opposing requirements.
Solution Approach 2:
The patent changes the physical state of the aperture from fixed to variable by using a deformable membrane that can alter its shape and size. This parameter change allows the aperture to adapt between different size states, enabling optimization of both cutting precision and power transmission efficiency under different operating conditions.
2Manufacturing precision
If a small aperture is used in the laser processing head, then peripheral radiation is reduced and cutting performance is improved, but heating of the processing head increases due to absorption and scattering
Solution Approach 1:
The deformable membrane allows dynamic adjustment of aperture size to optimize the balance between cutting performance and heat generation. When high precision cutting is required, the aperture can be reduced; when power transmission is prioritized, the aperture can be enlarged, thereby dynamically managing the temperature of the processing head.
Solution Approach 2:
The deformable membrane can be designed to respond automatically to temperature changes or control signals, adjusting its shape to maintain optimal operating conditions. This self-adjusting capability allows the system to manage its own thermal state, reducing the need for external cooling interventions.
3Manufacturing precision
If a small aperture is used in the laser processing head, then peripheral radiation is reduced, but productivity is reduced due to lower available power and feed rate
Solution Approach 1:
The deformable membrane enables real-time adjustment of aperture size, allowing the system to switch between precision-oriented small aperture mode and productivity-oriented large aperture mode. This dynamic adaptability resolves the contradiction by enabling the system to optimize for either quality or throughput depending on the specific processing requirements.
Solution Approach 2:
The deformable membrane structure serves multiple functions: it acts as both an aperture control mechanism and a power management device. By adjusting the membrane shape, the system can universally address both precision cutting requirements and high-productivity requirements, making the processing head adaptable to various operational priorities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach maximizes the use of laser power, reduces heating of the processing head, and enhances productivity by tailoring the aperture settings for specific cutting processes, ensuring optimal power distribution and minimizing waste during both flame and fusion cutting.
Implementation Method 1
the surface of the at least one aperture is designed to absorb the power of the processing laser source in a proportion of at least 90%
Implementation Method 2
the device for shaping the processing laser beam has at least one aperture that provides the at least one passage opening, and the surface of the at least one aperture is designed to absorb the power
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3a~4b
AI summary
A laser processing head for laser processing of a workpiece, in particular for laser cutting including flame cutting and fusion cutting, is provided, comprising an interface for a processing laser source for generating a processing laser beam; and a device for shaping the processing laser beam perpendicular to its direction of propagation, wherein the device for shaping the processing laser beam has at least one through-opening for the processing laser beam, the distance of which to the interface is adjustable. Furthermore, the use of a laser processing head and a method for laser processing of a workpiece, in particular for laser cutting including flame cutting and fusion cutting, with a laser processing head are described.