Laser Machining Head with Dynamic Beam Shaping and Process Observation
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Solution Overview
Problem
Existing laser machining systems face limitations in dynamic beam shaping and process observation, particularly for medium to large metal sheet thicknesses, leading to compromised cutting quality and reduced feed speeds due to fixed optical imaging ratios.
Innovation Solution
A machining apparatus with a first interface for a machining laser source and a second interface for a detector device, featuring first and second laser beam guiding devices that allow dynamic movement and shaping of the machining laser beam, enabling separate beam paths for the machining laser and process observation, allowing for high-frequency beam oscillation and flexible intensity distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If fixed optical imaging ratio is used in laser machining head, then device complexity is reduced, but manufacturing precision deteriorates due to compromised cutting quality and roughness
Solution Approach 1:
The patent applies dynamic beam shaping by replacing fixed optics with dynamically adjustable optical elements (such as deformable mirrors or variable focus lenses) that can change the beam profile and spot size in real-time during machining. This allows optimization of cutting quality for different material thicknesses and types without requiring multiple fixed optical systems, thus resolving the contradiction between device complexity and manufacturing precision.
2Device complexity
If fixed optical imaging ratio is used, then device complexity is reduced, but productivity deteriorates due to lower feed speeds
Solution Approach 1:
The dynamic beam shaping capability allows the laser system to optimize beam parameters on-the-fly according to machining conditions. For medium to large metal sheet thicknesses, the system can dynamically adjust to provide optimal energy concentration, enabling higher feed speeds without sacrificing cut quality, thereby improving productivity while maintaining reasonable device complexity.
3Measurement precision
If separate beam paths are implemented for machining laser and process observation, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent segments the optical path into separate channels: one for the machining laser beam and another for the observation/detection beam. This is achieved through beam splitting optics or spatial separation, allowing independent optimization of each path. The observation path can use fixed optics for stable imaging, while the machining path employs dynamic beam shaping, thus improving measurement precision without requiring the entire system to be overly complex.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables dynamic beam shaping and process observation simultaneously, improving cutting quality and feed speeds by allowing almost any intensity distribution and beam parameter products, while maintaining unaffected process observation and supporting high laser powers up to 10 kW.
Implementation Method 1
first laser beam guiding device (20) which guides the machining laser beam (15) to a second laser beam guiding device (22) and dynamically moves, in particular dynamically shapes, the machining laser beam (15)
Implementation Method 2
second laser beam guiding device (22) which guides the dynamically moved machining laser beam (15) through an outlet opening (18)
Implementation Method 3
at least partially guides the radiation (17) emitted by the machining zone (13) through the outlet opening (18) to the second interface (16)
Implementation Method 4
first interface (14) for a machining laser source for generating a machining laser beam (15)
Implementation Method 5
second interface (16) for a detector device for detecting radiation (17) emitted by the machining zone (13)
Data Source
AI summary
According to the present application, a machining apparatus (10) for the laser machining of a workpiece (12) in a machining zone (13) is provided, having a first interface (14) for a machining laser source for generating a machining laser beam (15), a second interface (16) for a detector device (for detecting radiation (17) emitted by the machining zone (13); an outlet opening (18) for the machining laser beam (14); and first and second laser beam guiding devices (20, 22), wherein the first laser beam guiding device (20), 20a, 20b) is arranged and designed such that it guides the machining laser beam (14) to the second laser beam guiding device (22) and dynamically moves the machining laser beam (14), and the second laser beam guiding device (22) is arranged and designed such that it guides the dynamically moved machining laser beam (14) through the outlet opening (18) and at least partially guides the radiation (17) emitted by the machining zone (13) through the outlet opening to the second interface (16). Further provided is a method for the laser machining of a workpiece (12).