Laser Machining Head With Independent Focus Control for Low-k Wafers
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Solution Overview
Problem
Existing laser machining devices for semiconductor wafers with low-k films face complexity and difficulty in adjusting focal positions separately for multiple machining units due to shared drive mechanisms, leading to potential delamination issues.
Innovation Solution
A laser machining device with a laser machining head that includes separate machining units for grooving and hollowing processes, equipped with focus adjustment units to independently adjust the focal positions of laser beams along the optical axis, allowing for precise control of machining units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If multiple machining units with separate drive mechanisms are provided within a single device, then each machining unit can be adjusted independently, but the device configuration becomes complex and large
Solution Approach 1:
The patent merges multiple machining units onto a single laser machining head, sharing common drive mechanisms and control systems. This integration reduces device complexity and size while maintaining the capability to perform different machining operations (groove machining and area machining) through a unified platform
2Device complexity
If multiple machining units are mounted on a single laser machining head with shared drive mechanism, then device complexity is reduced, but the focal position of each machining unit cannot be adjusted separately
Solution Approach 1:
The patent segments the focus adjustment capability by providing separate focus adjustment mechanisms for each machining unit (first focus adjustment unit for groove machining, second focus adjustment unit for area machining). This allows independent focal position control for each machining unit while maintaining a shared drive mechanism, resolving the contradiction between device simplicity and operational flexibility
3Ease of manufacture
If normal blade dicer is used to machine semiconductor wafers with low-k film, then machining can be performed, but delamination occurs
Solution Approach 1:
The patent replaces the mechanical blade dicing system with a laser-based machining system. The laser machining head uses optical fields instead of mechanical contact to machine grooves and areas in semiconductor wafers with low-k films, eliminating the mechanical forces that cause delamination while maintaining effective machining capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables separate adjustment of focal positions between machining units, reducing device complexity and minimizing delamination during the machining of semiconductor wafers with low-k films.
Implementation Method 1
a laser machining device for machining a workpiece by radiating a laser beam from a laser machining head to the workpiece
Implementation Method 2
radiating a laser beam... to machine two grooves... machine an area between the two grooves
Data Source
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AI summary
A laser machining device for machining a workpiece by radiating a laser beam from a laser machining head to the workpiece to which a machining feed operation is relatively applied. The laser machining head includes a first machining unit configured to machine two grooves by radiating a pair of laser beams to the workpiece, a second machining unit configured to machine an area between the two grooves by radiating a second laser beam between the two grooves machined by the first machining unit, and a first focus adjustment unit configured to adjust a relative positional relationship between a focus of the first laser beam and a focus of the second laser beam in an optical axis direction by relatively moving a focal position of the second laser beam with respect to a focal position of the first laser beam in the optical axis direction.