Laser Head Calibration for Optical Axis and Probe Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Laser beam machines with touch probes or electric capacity sensors suffer from errors in measuring the dimensions and shape of workpieces, leading to reduced machining accuracy due to misalignment of the optical axis and sensor positions.
Innovation Solution
A method to accurately measure the position of the touch probe relative to the optical axis of the laser beam by using a calibration unit with a calibration ring assembly and cameras to calculate deviations, allowing precise alignment and machining.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a touch probe or electric capacity sensor is attached to a laser beam machining head, then the dimensions and shape of the workpiece can be measured, but the measurement accuracy deteriorates due to attachment errors causing misalignment between the optical axis and sensor position
Solution Approach 1:
The patent replaces the mechanical attachment method with an optical measurement system. Instead of physically attaching sensors to the machining head, the invention uses a camera to optically measure the position of the touch probe relative to the optical axis, eliminating mechanical attachment errors and achieving higher measurement precision without compromising machining accuracy
Solution Approach 2:
The patent introduces a camera as an intermediary measurement device. The camera captures images of the touch probe position and the optical axis position separately, then calculates the relative position through image processing. This intermediary optical measurement system acts as a mediator between the mechanical components, providing accurate position data without direct mechanical contact or attachment errors
2Manufacturing precision
If the position of the touch probe relative to the optical axis is not measured, then the device complexity is reduced, but the machining accuracy deteriorates due to uncorrected attachment errors
Solution Approach 1:
The patent replaces complex mechanical alignment and measurement systems with a simplified optical measurement approach using a camera. Instead of using complex mechanical sensors attached to the machining head, the invention uses optical imaging to measure positions and calculate relative coordinates, reducing device complexity while improving machining accuracy
Solution Approach 2:
The patent creates optical copies (images) of the physical components. The camera captures images of the touch probe and optical axis positions, creating visual representations that can be processed to determine relative positions. This copying approach simplifies the measurement system by replacing direct mechanical measurement with optical replication and digital processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-accuracy machining by determining the relative position between the laser beam machining point and the workpiece, improving the overall precision of the machining process.
Implementation Method 1
measuring the positions of the measurement reference by the optical sensor
Implementation Method 2
machining a workpiece by directing the laser beam through a liquid flow
Data Source
Figure 1
Figure 2
Figure 3
AI summary
This laser processing machine (100), which moves a work piece, which is mounted on a table (108), and an optical head (10), which shines a laser light, relative to each other, and processes the work piece by irradiating the work piece with the laser light, is provided with: a calibration camera (42) that is fixed to the optical head (10); a probe (40) that is fixed to the optical head (10); and a calibration unit (50) that has measurement reference points (Pc1, Pc2, Pc3, Pp1, Pp2, Pp3) for measuring the position of the calibration camera (42) and the probe (40), and a processing portion (68) that forms a processing mark (L1, L2) due to the laser light.