Semiconductor Laser Heat Dissipation with Wind-Blocking Tube
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Solution Overview
Problem
Conventional high-output semiconductor laser light source devices face challenges with heat dissipation, leading to reduced light output and shorter service life due to heat accumulation, and the use of cooling fans can introduce dust and wind that affects the optical path, causing flicker and deterioration in light quality.
Innovation Solution
A light source device with a heat dissipation member on the emission side of the semiconductor laser, incorporating a wind-blocking tube within the heat dissipation member to prevent wind interference and dust accumulation, ensuring efficient heat dissipation while maintaining light quality by sealing the optical path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation members are provided on multiple faces including the light emission face, then heat dissipation efficiency is improved, but wind from cooling fans interferes with the optical path causing dust accumulation and light flicker
Solution Approach 1:
The heat dissipation function is segmented from the optical path. The light emission face does not have a heat dissipation member, while separate heat dissipation members are provided on other faces (side face and/or rear face) of the semiconductor laser device. This segmentation allows cooling fans to be positioned away from the optical path while still providing effective heat dissipation through multiple surfaces.
Solution Approach 2:
The patent introduces an intermediary structure (heat dissipation members on non-emission faces) that enables heat dissipation without direct exposure of the optical path to cooling airflow. The cooling system acts as an intermediary between the heat source and the external environment, preventing direct wind contact with the emitted light while still achieving thermal management.
2Volume of moving object
If semiconductor laser devices are disposed in the same plane with reduced spacing, then device size is reduced, but heat accumulation increases leading to lower light output and shorter service life
Solution Approach 1:
The patent transitions from two-dimensional heat dissipation (single face) to three-dimensional heat dissipation by placing heat dissipation members on multiple faces (side face, rear face, and/or front face excluding the light emission face). This dimensional expansion of the heat dissipation surface area enables more effective heat removal from closely-spaced laser devices without increasing the device footprint.
3Temperature
If cooling fans are used to dissipate heat from heat dissipation members, then heat dissipation is improved, but dust accumulates on optical parts and wind affects the light causing flicker
Solution Approach 1:
The patent extracts the heat dissipation function from the light emission face, removing the source of wind interference from the optical path. By placing heat dissipation members on other faces and positioning cooling fans accordingly, the harmful wind effect is separated from the light emission region while the beneficial heat dissipation function is preserved.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively cools the semiconductor laser device, preventing wind effects on the light and reducing dust accumulation, thereby enhancing heat dissipation and maintaining the purity and strength of the light passing through the optical engine.
Implementation Method 1
a heat dissipation member in contact with a light emission side of the semiconductor laser device out of the heat dissipation face
Implementation Method 2
the heat is dissipated by a cooling fan
Data Source
AI summary
The present disclosure relates to a light source device. The light source device includes: a semiconductor laser device having a heat dissipation face; a heat dissipation member in contact with a light emission side of the semiconductor laser device out of the heat dissipation face, the heat dissipation member having a window that emits light from the semiconductor laser device, and a wind-blocking tube provided inside the window.