Semiconductor Laser Heat Sink Layout for Spray Cooling Efficiency
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Solution Overview
Problem
The existing semiconductor laser devices face challenges in improving the cooling efficiency of semiconductor laser elements, particularly for those with long resonator lengths and high heat generation, such as quantum cascade lasers, due to suboptimal configurations of internal cooling fluid paths in the heat sink.
Innovation Solution
A semiconductor laser device design featuring a heat sink with a supply port and discharge port positioned apart from the semiconductor laser element, incorporating spray holes aligned with the resonance direction and discharge paths intersecting it, which enhances the cooling fluid's flow and heat dissipation efficiency, along with gold plating to maintain fluid pressure and a spacer for efficient current injection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the resonator length of the semiconductor laser element is increased, then the laser performance is improved, but the heat generation increases and cooling efficiency deteriorates
Solution Approach 1:
The heat sink body is divided into multiple functional regions: a supply port region, a disposition region for the laser element, and a discharge port region. The supply path segments the cooling fluid delivery into directed channels that lead to spray holes positioned near the laser element, enabling localized cooling where heat generation is most intense.
Solution Approach 2:
The invention employs a cooling fluid delivery system where liquid cooling fluid is supplied through the supply path and sprayed directly onto the laser element via spray holes. This hydraulic approach efficiently removes heat from the high-power laser element, enabling sustained operation with longer resonator lengths that generate more heat.
2Device complexity
If the internal cooling fluid paths are configured suboptimally, then the device structure is simpler, but the cooling efficiency deteriorates
Solution Approach 1:
The cooling system is designed with local quality by concentrating cooling resources where needed most. Spray holes are positioned in the disposition region to directly cool the laser element, while the supply and discharge ports are positioned apart from the disposition region to optimize fluid flow paths. This localized cooling approach maximizes cooling efficiency without requiring overly complex internal path configurations.
3Length of stationary object
If the supply port and discharge port are positioned close to the disposition region, then the internal paths are shorter, but the cooling fluid flow efficiency deteriorates
Solution Approach 1:
The invention optimizes the spatial arrangement of ports and paths by considering three-dimensional flow dynamics. The supply port and discharge port are positioned apart from the disposition region, creating an optimized flow path that moves cooling fluid efficiently through the heat sink body. This dimensional optimization ensures adequate flow velocity and heat removal capacity while maintaining reasonable path lengths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the cooling efficiency of the semiconductor laser element, allowing for efficient heat dissipation even with long resonator lengths, simplifies the device structure, and enables short-pulse operation with reduced energy loss.
Implementation Method 1
spray holes that spray the cooling fluid guided by the supply path, from below the disposition region
Implementation Method 2
a supply path that guides the cooling fluid supplied from a supply port side, toward the disposition region
Implementation Method 3
a heat sink that cools the semiconductor laser element
Data Source
AI summary
In a semiconductor laser device, a supply path that guides a cooling fluid supplied from a supply port side, toward a disposition region, spray holes that spray the cooling fluid guided by the supply path, from below the disposition region, and a discharge path that guides the cooling fluid sprayed from the spray holes, toward a discharge port are provided within a body portion of a heat sink. The spray holes are disposed along a resonance direction of a semiconductor laser element disposed in the disposition region, and the discharge path extends in a direction intersecting with the resonance direction of the semiconductor laser element disposed in the disposition region.