Laser-Heated Bonding Tool With Temperature Feedback Control

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Solution Overview

Problem

Existing ultrasonic bonding technologies lack an efficient method to heat and monitor the actual temperature of the bonding tool, which can lead to improper heating and potential damage to the bonding tool or joining partners.

Innovation Solution

A device comprising a bonding tool with an absorption region on its lateral surface, a temperature measuring unit positioned on the bonding tool, and a laser generator to direct a laser beam onto the absorption region for heating, while the temperature measuring unit determines the actual temperature of the bonding tool.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If thermal energy is supplied to heat the bonding tool or substrate, then bonding process time is reduced and difficult-to-bond materials can be processed, but risk of impermissible heating and damage to bonding tool or joining partner increases

Engineering Contradiction:

Improvebonding process timeVSAvoidimpermissible heating

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent implements a temperature measurement unit that continuously monitors the actual temperature of the bonding tool and provides feedback to the control unit. This feedback mechanism enables real-time adjustment of heating parameters, allowing the system to maintain optimal bonding temperature while preventing impermissible heating and damage to the bonding tool or joining partner.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent performs preliminary temperature measurement and evaluation before the bonding process begins. The control unit determines whether the measured temperature is within the permissible range and adjusts heating parameters in advance, ensuring safe operating conditions are established before actual bonding occurs.

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If temperature measurement is implemented to monitor bonding tool temperature, then bonding quality and reproducibility are improved, but device complexity increases

Engineering Contradiction:

Improvebonding qualityVSAvoiddevice structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent designs the temperature measurement unit and control system to serve multiple functions: monitoring bonding tool temperature, determining permissible operating ranges, adjusting heating parameters, and preventing damage. This multi-functionality approach improves bonding quality while minimizing the increase in device complexity by consolidating control functions.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of operation

If laser beam is used to heat the bonding tool, then targeted heating is achieved, but risk of localized overheating and damage increases

Engineering Contradiction:

Improvetargeted heating capabilityVSAvoidlocalized overheating

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent uses the temperature measurement unit to continuously monitor the temperature at the laser heating zone and provides feedback to the control unit. This enables real-time adjustment of laser power and duration, ensuring targeted heating is achieved while preventing localized overheating and damage to the bonding tool or joining partner.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent applies laser heating in a controlled, partial manner by precisely targeting specific regions of the bonding tool that require heating. The control unit regulates the laser parameters to provide exactly the amount of heat needed, avoiding excessive localized heating that could cause damage.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for targeted and monitored heating of the bonding tool, preventing overheating and ensuring consistent high-quality bonding results by accurately measuring the bonding tool's temperature.

Implementation Method 1

a laser generator, a laser beam being provided with the aid of the laser generator, and the laser beam striking the bonding tool in the absorption region, and the bonding tool being heated as a result of the absorption of the laser beam

Methodology Applied

Scientific EffectAbsorption (EM radiation): Absorption (EM radiation)

Implementation Method 2

a temperature measuring unit for determining the actual temperature of the bonding tool at a temperature measuring point, which is provided on the lateral surface of the bonding tool

Methodology Applied

Scientific EffectTemperature measurement:

Data Source

PatentUS12202065B2Device for heating and determining an actual temperature of a bonding tool of an ultrasonic bonding device

Publication Date: 2025.01.21 HESSE

AI summary

A device for heating and determining the actual temperature of a bonding tool of an ultrasonic bonder, comprising the bending tool, which has a first end face, a second end face, a lateral surface, which connects the first end face to the second end face, and an absorption region, comprising a temperature measuring unit for determining an actual temperature of the bonding tool at a temperature measuring point, which is provided on the lateral surface of the bonding tool and preferably at a tip of the bonding tool, and comprising a laser generator, a laser beam being provided with the aid of the laser generator, and the laser beam striking the bonding tool in the absorption region, and the bonding tool being heated as a result of the absorption of the laser beam.