Laser Heating Substrate Processing Apparatus
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing methods for semiconductor devices face challenges in efficiently heating substrates during chemical liquid processing, particularly in achieving uniform and rapid heating while preventing entanglement of heating elements during rotation.
Innovation Solution
A substrate processing apparatus that includes a rotating substrate holding part with a laser irradiation head fixed below the mounting table, which controls the rotation and laser irradiation to efficiently heat the substrate using a hot plate with partitioned regions and temperature sensors for precise feedback control, allowing for local and uniform heating without the need for rotating heating elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a resistance heater is provided in a disc portion of a substrate holder, then the substrate can be heated during chemical liquid processing, but the heating element may become entangled during rotation and uniform heating is difficult to achieve
Solution Approach 1:
Instead of placing the heating element on the rotating substrate holder, the patent inverts the configuration by placing the laser irradiation head on the stationary side below the mounting table. The laser beam passes through the transparent mounting table to heat the substrate from below, eliminating the need for rotating heating elements and avoiding entanglement issues entirely.
Solution Approach 2:
The patent replaces the mechanical resistance heater with a laser-based heating system. The laser beam delivers thermal energy without physical contact, substituting a mechanical heating element with an optical field that can penetrate the transparent mounting table and heat the substrate uniformly during rotation.
2Temperature
If a resistance heater is used in the substrate holder, then heating can be provided, but rapid temperature adjustments and precise temperature control are difficult to achieve
Solution Approach 1:
The patent replaces the slow thermal response of resistance heaters with the rapid energy delivery of laser beams. The laser system can be quickly turned on/off and adjusted in power, enabling rapid temperature changes and precise control through feedback mechanisms, as the laser energy is delivered instantaneously rather than through gradual thermal conduction.
Solution Approach 2:
The patent implements a feedback control system where temperature sensors monitor the substrate temperature and the controller adjusts the laser irradiation accordingly. This closed-loop control enables precise temperature maintenance and rapid adjustment by continuously comparing actual temperature with target temperature and modifying laser power in real-time.
3Temperature
If heating elements are integrated into the rotating substrate holder, then direct heating is achieved, but the structure becomes complex and maintenance becomes difficult
Solution Approach 1:
The patent inverts the heating configuration by placing the laser source on the stationary side below the mounting table rather than integrating it into the rotating holder. This separation allows the laser system to remain stationary and easily maintainable while still achieving efficient heating through the transparent table, eliminating the complexity of integrating rotating electrical connections.
4Temperature
If the laser irradiation head is positioned close to the mounting table, then heating efficiency is improved, but the risk of damage to the laser head increases
Solution Approach 1:
The patent positions the laser irradiation head in the vertical dimension below the transparent mounting table, separated by a safe distance. The laser beam travels through the transparent table material to reach the substrate, utilizing the table's optical transparency to deliver heating efficiency without requiring the laser head to be in close proximity, thus protecting it from damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-efficiency heating of substrates with rapid temperature adjustments, preventing entanglement and achieving uniform heating, which shortens processing times and improves the accuracy of temperature control, thereby enhancing the processing of semiconductor substrates.
Implementation Method 1
a laser irradiation head configured to irradiate a laser beam toward a lower surface of the mounting table
Data Source
AI summary
There is provided a substrate processing apparatus, including: a substrate holding/rotating part configured to hold a substrate on a mounting table and rotate the substrate; a laser irradiation head configured to irradiate a laser beam toward a lower surface of the mounting table; and a controller configured to control at least the rotation of the substrate holding/rotating part and the irradiation of the laser beam. The laser irradiation head is fixed below the mounting table so as to be spaced apart from the mounting table. The controller controls the laser irradiation head to irradiate the laser beam when the mounting table is rotated by the substrate holding/rotating part.