Laser Heating Substrate Treating Apparatus for Thin Film Uniformity
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Solution Overview
Problem
Existing substrate treating methods face challenges in uniformly heating thin film layers during photolithography processes, leading to non-uniform heat transfer and potential damage to patterns on the substrate, especially when trying to selectively heat specific layers.
Innovation Solution
A substrate treating apparatus and method that uses obliquely incident laser light to heat a specific metal-containing thin film layer, allowing for precise control of the heating area by moving the substrate while maintaining a consistent light angle, thereby minimizing pattern damage and achieving uniform heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a heating plate is used to indirectly heat the substrate, then the heating process is simple to implement, but the heat transfer uniformity to the thin film layer is poor
Solution Approach 1:
The patent replaces the mechanical heating plate system with an optical laser heating system. The laser beam directly irradiates the thin film layer, eliminating the need for mechanical contact through a heating plate. This substitution enables precise control of heat distribution by adjusting laser parameters such as power, scanning speed, and beam focus, thereby achieving uniform heat transfer while maintaining process simplicity.
2Temperature
If a heat source is vertically irradiated on the substrate, then the thin film layer can be directly heated, but the pattern below the substrate may be damaged
Solution Approach 1:
The patent applies local quality by selectively heating only the thin film layer through optimized laser irradiation parameters. By controlling the laser wavelength, power density, and scanning speed, the heat is concentrated precisely on the thin film layer while the underlying patterns receive minimal or no heat exposure. This localized heating approach maintains high heating efficiency for the target layer while preventing damage to underlying structures.
3Ease of operation
If the heat source intensity is not precisely controlled, then the heating process is simple, but it is difficult to selectively heat a specific thin film layer among multiple layers
Solution Approach 1:
The patent employs parameter changes to achieve selective heating of specific thin film layers. By adjusting laser parameters including wavelength, power intensity, pulse duration, and scanning speed, the heating process can be precisely controlled to target specific layers. Different thin film layers have different optical absorption characteristics at various wavelengths, allowing selective heating by choosing appropriate laser parameters while maintaining operational simplicity through automated parameter control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient and selective heating of thin film layers, reducing pattern damage and ensuring uniform heat distribution, which improves the substrate treatment process in photolithography.
Implementation Method 1
irradiating light to a first thin film layer including a metal among the plurality of thin film layers to heat the first thin film layer
Implementation Method 2
irradiating light to a first thin film layer including a metal among the plurality of thin film layers to heat the first thin film layer
Data Source
AI summary
Provided is a method for treating a substrate. The method for treating the substrate may include heating a substrate formed with a plurality of thin film layers including a photoresist layer formed on a surface, and irradiating light to a first thin film layer including a metal among the plurality of thin film layers to heat the first thin film layer.